With the continuous upgrading and transformation of the intelligentisation of China's manufacturing industry, and in response to the requirements for further intelligentisation of the phosphor copper ball production line proposed by a new electronic material company, this study proposes a fault prediction and diagnosis method based on big data. A high-efficiency distributed big data platform is constructed, and a workshop-level monitoring centre with the Windows control centre (WinCC) as the core is formed. The WinCC configuration software is used to monitor the key parameters of the equipment during the operation phase, and the login interface is configured according to the requirements of workshop information integration, for example, display interface, alarm interface, debugging interface, trend graph and other common functions. Cloud platforms and virtual private network (VPN) communication are used to realise remote maintenance. Aiming at the common fault problems in the production process, an expert diagnosis system based on fault tree analysis is constructed by fusing the fault tree theory and expert systems. The fault tree model of the unqualified phosphor copper ball production quality and the failure of the hydraulic system is highlighted. Therefore, ensuring the safety of the phosphor copper ball production line is of great significance to the entire production system.
Microcrystalline phosphor copper balls with a diameter of 28 mm were prepared via continuous extrusion upsetting. Optical microscopy and electron backscatter diffraction were used to study the microstructural evolution of phosphor copper balls during the formation process. In addition, the hardness distribution and tensile properties were tested. The results show that fine dynamic recrystallisation grains and twins were formed after continuous extrusion and that the grains were further refined after upsetting. After continuous extrusion upsetting, there were typical 〈111〉, 〈100〉, and 〈110〉 fibre textures, and the proportions of these three textures in the individual samples were different. The change in microhardness was affected by the microstructure. The increase in the hardness value from casting and continuous extrusion upsetting was owing to pronounced grain refinement. The grain sizes from the centre to the edge were similar, and the grain refinement was more uniform. Notably, the grain size of the extruded rod was still fairly uniform from the centre to the edge in the radial direction. It can be concluded that the continuous extrusion-upsetting phosphor copper anode is more conducive to the formation of black film, that is, it is more suitable for electroplating anode material.
To improve the quality of electroplated copper anodes and reduce the amount of anode mud, it is necessary to further refine copper grains. In the electronics industry, this is typically accomplished by either extrusion or cryogenic treatment. In this study, samples were subjected to different cryogenic treatment periods, and SEM, EDS, XRD, and hardness tests were performed. It was confirmed that a sub-grain boundary was formed due to the disappearance of vacancies and an increase in dislocations after the cryogenic treatment of extruded copper, which improved the grain refinement and hardness. At longer treatment times, the combination and entanglement of dislocations reduced the strengthening effect, and the copper diffraction peaks changed. However, the distribution of trace phosphorus did not change with the grain refinement distribution. Therefore, the results confirm that cryogenic treatment can be used to refine the grains of extruded copper.
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