A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.
This review provides a comprehensive recap of noise research in MEMS. Some background on noise and on MEMS is provided. We review noise production mechanisms, and highlight work on the theory and modeling of noise in MEMS. Then noise measurements in the specific types of MEMS are reviewed. Inertial MEMS (accelerometers and angular rate sensors), pressure and acoustic sensors, optical MEMS, RF MEMS, surface acoustic wave devices, flow sensors, and chemical and biological MEMS, as well as data storage devices and magnetic MEMS, are reviewed. We indicate opportunities for additional experimental and computational research on noise in MEMS.
Articles you may be interested inOn the stability of the steady-state solutions of cell equations in a tumor growth model AIP Conf.An iterative method for solving the discretized steady-state semiconductor device equations is presentedo This method uses GummeI's block iteration technique to decouple the nonlinear Poisson and electron-hole current continuity equations. However, the main feature of this method is that it takes advantage of the diagonal nonlinearity of the discretized equations, and solves each equation iteratively by using the nonlinear Jacobi method. Using the fact that the diagonal nonlinearities are monotonically increasing functions, it is shown that this method has two important advantages. First, it has global convergence, i.e., convergence is guaranteed for any initial guess. Second, the solution of simultaneous algebraic equations is avoided by updating the value of the electrostatic and quasi-Fermi potentials at each mesh point by means of explicit formulae. This allows the implementation of this method on computers with small random access memories, such as personal computers, and also makes it very attractive to use on parallel processor machines. Furthermore, for serial computations, this method is generalized to the faster nonlinear successive overrelaxation method which has global convergence as well. The iterative solution of the nonlinear Poisson equation is formulated with energy-and position-dependent interface traps. It is shown that the iterative method is globally convergent for arbitrary distributions of interface traps. This is an important step in analyzing hot-electron effects in metal-oxide-silicon field-effect transistors (MOSFETs). Various numerical results on two-and three-dimensional MOSFET geometries are presented as well.
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