The thermal stability in structural and electrical properties of HfO 2 , HfAlO x alloy, and Al 2 O 3 /HfO 2 stack thin films prepared by atomic layer deposition were comparatively investigated. Both HfAlO x and Al 2 O 3 /HfO 2 exhibit improved property against thermal degradation compared to the HfO 2 film. However, the incorporation of Al in alloy form provides characteristics superior to that in stack structure by retaining an amorphous structure up to 1000°C, which suppresses the leakage current and retards the growth of interfacial layer giving rise to lower increment of equivalent-oxide-thickness and interface trap density.
The charge storage characteristics of metal-oxide-semiconductor structures containing Au nanocrystals in atomic-layer-deposited high-k gate dielectrics were studied. Cross-sectional high-resolution transmission electron microscopy reveals that the Au nanocrystals are self-assembled in the high-k dielectric matrix after high temperature annealing in N2 ambient. The memory effect was observed from capacitance-voltage (C-V) relations and a satisfactory charge retention characteristic was obtained in the sample using Al2O3 as the gate dielectric than in the one using Hf2AlOx. Moreover, a saturation of electron storage in the metal-oxide-semiconductor capacitors was also observed.
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