The study conducts the reliability test of the flip chip ball grid array (FCBGA) components with both the cyclic bend tests and shear tests for three types of solder materials: the eutectic solder with compositions of Sn63Pb37, and the lead free solder with compositions of both SnAg3.OCuO.5 and SnAg4.OCuO.5. The final results for the cycles to failure data of different solder ball materials are plotted with the Weibull plots. It shows that the slope of the Weibull plot for the eutectic solder material is larger than that of the lead free solder materials with compositions of SnAg3.OCuO.5 and SnAg4.OCuO.5. This indicates that the lead free solder materials have much variation in the failed cycles during the cyclic test. It is noteworthy that the FCBGA components with SnAg3.OCuO.5 solder have the best durability both in the cyclic bend and shear tests. Moreover, the failure mode analysis is utilized to observe the failure locations for the test component under the cyclic bend and shear tests. It is observed that the failure of the FCBGA component are either at the interface between bulk solder and the package side metal, or between the bulk solder and the printed circuit board side metal. IntroductionWith the increasing needs of complicated functions for electronic devices, it has driven the packaging technology to move towards the high interconnection density, high input/output (I/0) FCBGA package over the recent years. Besides, the legislation in Europe, Japan and the United States are providing the impetus for converting the leaded solders into environmentally friendly materials. Consequently, various types of the lead free solder materials are available today with different compositions of Sn, Ag, Bi and Cu for the applications of the green electronics. However, what are the impact on the component reliability after adopting to the lead free solder materials or the effects of using different compositions of the lead free solder, are all important issues for the development of the new package design such as the FCBGA components in satisfy the RoHS requirements. Therefore, the accelerated thermal cycling (ATC) and thermal shock (TS) tests are typically conducted to evaluate the reliability of the solder joints. For example, Arulvanan [1] investigated the reliability of the PBGA component with Snrich and Ag-rich for the Sn-Ag solder materials through thermal cycling tests. The results show that the failures were not found before 5700 thermal cycles. Besides, the characteristic lives of all solder joints were more than 7200 thermal cycles and the intermetallic thicknesses were all less than 3 pim. Further, Pang [2] studied the thermal aging effect
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.