(accessed July 10, 2009).The capabilities of a high average power picosecond laser are assessed for micromachining yttria‐stabilized tetragonal zirconia polycrystal (Y‐TZP) in its hard state. Laser machining of this material presents an attractive alternative to conventional machining techniques when precision customized parts are required due to the difficulty in machining Y‐TZP in its hard state. Compared with previous nanosecond work the picosecond laser enables similar micromachining to be carried out at the same rate but with a superior surface finish and with no evidence of surface cracking. Strength measurements have been carried out using a four‐point bend test rig and confirm that the improvement in surface quality translates to higher strength in machined components.

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As electronic devices shrink in size to reduce material costs, device size and weight, thinner material thicknesses are also utilized. Feature sizes are also decreasing, which is pushing manufacturers towards single step laser direct write process as an attractive alternative to conventional, multiple step photolithography processes by eliminating process steps and the cost of chemicals. The fragile nature of these thin materials makes them difficult to machine either mechanically or with conventional nanosecond pulsewidth, Diode Pumped Solids State (DPSS) lasers. Picosecond laser pulses can cut materials with reduced damage regions and selectively remove thin films due to the reduced thermal effects of the shorter pulsewidth. Also, the high repetition rate allows high speed processing for industrial applications. Selective removal of thin films for OLED patterning, silicon solar cells and flat panel displays is discussed, as well as laser cutting of transparent materials with low melting point such as Polyethylene Terephthalate (PET). For many of these thin film applications, where low pulse energy and high repetition rate are required, throughput can be increased by the use of a novel technique to using multiple beams from a single laser source is outlined.