This paper describes a novel, non-intrusive method for the detection of faults within printed circuit boards (PCBs) and their components using digital imaging and image analysis techniques. High-resolution X-ray imaging systems provide a means to detect and analyze failures and degradations down to micron-levels both within the PCB itself and the components that populate the board. Further, software tools can aid in the analysis of circuit features to determine whether a failure has occurred, and to obtain positive visual confirmation that a failure has occurred. Many PCB and component failures previously undetectable through today's test methodologies are now detectable using this approach.
An innovative approach is described for diagnosing faults in printed circuit boards (PCB) and PCB components through the detection, analysis, and localization of electrical field changes that occur within and around the PCB. This method utilizes electromagnetic emissions (EME) originating from the PCB to determine circuit health. EME from rapidly changing voltages and currents within high-speed logic and other circuits have traditionally been seen as a problematic source of interference that must be eliminated to as great an extent as possible. However, changes within these emissions can be a highly significant indicator that a failure has occurred within a PCB component as well as within adjacent circuit card paths of the board itself. Further, the hardware and software requirements needed to capture and analyze these emissions are relatively simple in comparison to today's highly complex automatic test equipment. This unique approach involves analyzing electromagnetic emission signatures through automated means, and ascribing failures to the circuit board as a whole, as well as to the individual circuit board components.
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