In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called "membrane method". Persistence of the vacuum was proven. No getter materials were used for packaging
Sowohl im Falle der Kondensation von Silicatanionen als auch‐der hydrolytischen Spaltung von Si‐O‐Si‐Bindungen in Silicaten durch OH(‐)‐Ionen sowie bei der Koagulation findet in Abhängigkeit von der Zeit eine Änderung der elektrischen Leitfähigkeit statt.
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