Defect states responsible for leakage current in ultrathin (physical thickness <10 nm) tantalum pentoxide (Ta2O5) films were measured with a novel zero-bias thermally stimulated current technique. It was found that defect states A, whose activation energy was estimated to be about 0.2 eV, can be more efficiently suppressed by using N2O rapid thermal annealing (RTA) instead of using O2 RTA for postdeposition annealing. The leakage current was also smaller for samples with N2O RTA than those with O2 RTA for postdeposition annealing. Hence, defect states A are quite likely to be important in causing leakage current.
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