It has been reported previously that the mechanism for the erosion-corrosion of copper (Cu) in seawater is the removal of protective layers by hydrodynamic shear. This hypothesis was tested by studying the anodic dissolution of Cu in aerated 3.5 wt% sodium chloride (NaCl) solutions using a system designed to isolate the effect of surface shear stress. The experimental apparatus consisted of an axisymmetric impinging jet and disk electrode coupled with a scanning ellipsometer. This allowed a phenomenon occurring at a critical shear stress, such as removal of protective films, to be seen at a corresponding radial position. Enhancement of the corrosion rate, as measured electrochemically, was less than would have been caused by an increase in overall convective transport. The ellipsometer did not indicate the presence of any critical radius, even though the shear stress at the Cu electrode was an order of magnitude higher than the critical shear stress reported in the literature. Therefore, the critical shear stress previously reported in the literature could not be attributed to removal of protective layers by hydrodynamic shear.
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