The present paper refers to the manufacturing of some profiled (leadless inverted devices-LID) metal-ceramic micropackages for which metal-ceramic joining is realised by the metal to metal diffusion mechanism. Using corundum ceramic and electronic purity materials, the ceramic micropackages have been realized by adapting technological processes (deposition of metallic films, etching, etc.) and equipment specific to the electronic component industry. Profiled metal-ceramic micropackages, have been used to encapsulate some types of power microwave diodes, Pin, Schottky.
This paper presents the manufacturing and the characterization of GaN membrane supported MSM photodetector structures obtained by means of nanolithographic techniques. Two different runs of MSM photodetectors, with different dimensions of the MSM structures and different GaN membrane thickness, have been performed and the detectors performances are annalised. Very low dark currents and unexpected high values, in the range of 50-100A/W for the UV detectors responsivity have been obtained.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.