The lotus type porous copper heat sink has a higher heat transfer capacity as compared to micro channel heat sink for same size. Many studies on this heat sink show that its heat transfer capacity can be further improved by improving design of heat sink. This study investigates the heat transfer and flow characteristics of porous heat sink with different designs of internal bifurcations under both laminar & turbulent flow and studies the effect of such bifurcations on heat transfer of heat sink. The results of heat sink with bifurcations are compared with that of heat sink without bifurcations which show that for case of both laminar & turbulent flow, the heat sink with bifurcation showed better thermal performance as compared to heat sink without bifurcations.
An improvement in performance of hybrid solar system with use of liquid metal alloy GaInSn as a coolant has been demonstrated in this study. The performance of hybrid system using GaInSn, water, and air as coolants under different operating conditions such as ambient temperature, different inlet velocities of fluid, solar irradiations is analyzed using simulation software ANSYS and the results obtained are validated using experiments. The results obtained from simulations and experiments are used for determining important performance criteria such as electrical efficiency, thermal efficiency, and exergy efficiency. The exergy, thermal, and electrical efficiencies were found to be at least 11%, 12%, and 12% higher for hybrid system using GaInSn as a coolant when compared to hybrid systems using air and water as coolants, respectively.
The reliability, life and efficiency of electronic components is determined by amount of current passing through them to perform their duties. This has made electronic components to be potential sites for excessive heat generation. Apart from this fact, technological development has also resulted in miniaturization of electrical and electronic components which has also shown its impact on life of electronic components by reducing their reliability further. Thus need of the hour is to increase reliability and life of these components by removing this excess heat generated. A common method used for this purpose is use of active cooled heat sinks that have an advantage of lesser weight as compared to active cooled heat sinks and are capable of removing more amount of heat for same surface area of active cooled heat sink. An up gradation of this technique is to embed heat sinks with heat pipes that are capable of removing more heat for same surface area as compared to that without heat pipe. This heat sink embedded with heat pipe has to be effectively deigned to improve its thermal performance. Thus this paper represents a methodology to optimize the temperature of insulated gate bipolar transistor (IGBT) by optimizing the dimensions of heat sink embedded with heat pipe by using design of experiments method with L12 orthogonal array combination (8 factors with 2 levels). The simulation results were performed using ANSYS CFX and compared with experiments results for validation. The optimized parameters of heat sink embedded with heat pipes was determined by plotting of main effects and S/N ratio response plot using minitab software. The rank of factors that influence temperature on IGBT was also identified using the same. Further the interaction plot was also plotted to study the interaction between different factors and how they affect the temperature on the IGBT.
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