In this study, the chemical decomposition of a polyimide-film (i.e., a PI-film)-surface into a soft-film-surface containing negatively charged pyromellitic dianhydride (PMDA) and neutral 4,4′-oxydianiline (ODA) was successfully performed. The chemical decomposition was conducted by designing the slurry containing 350 nm colloidal silica abrasive and small molecules with amine functional groups (i.e., ethylenediamine: EDA) for chemical–mechanical planarization (CMP). This chemical decomposition was performed through two types of hydrolysis reactions, that is, a hydrolysis reaction between OH− ions or R-NH3+ (i.e., EDA with a positively charged amine groups) and oxygen atoms covalently bonded with pyromellitimide on the PI-film-surface. In particular, the degree of slurry adsorption of the PI-film-surface was determined by the EDA concentration in the slurry because of the presence of R-NH3+, that is, a higher EDA concentration resulted in a higher degree of slurry adsorption. In addition, during CMP, the chemical decomposition degree of the PI-film-surface was principally determined by the EDA concentration; that is, the degree of chemical composition was increased noticeably and linearly with the EDA concentration. Thus, the polishing-rate of the PI-film-surface increased notably with the EDA concentration in the CMP slurry.
We studied the formation of a resist pattern by a zero residual layer process with microimprint lithography ͑MIL͒ using a soft mold. Polyethylene glycol-dimethacrylate as an UV hardening-type resist and polydimethylsiloxane as a soft mold were used for the MIL process. The stripe and square patterns with a zero residual layer process were achieved on Cr/glass. UV ozone was treated on the Cr to achieve a hydrophilic surface for a zero residual layer process, which was confirmed by the measurements of cross-sectional scanning electron microscopy and energy-dispersive X-ray microanalysis.Photolithography is widely used in the fabrication process of thin-film devices for flat panel displays ͑FPDs͒. Conventional photolithography requires a high-cost process for the manufacturing of the active-matrix liquid-crystal display ͑AMLCD͒ backplane. Many techniques have been developed to reduce the cost of thin-film patterning. The number of photomasks used in manufacturing the AM-LCD backplanes was reduced to four. 1 Recently, many kinds of smart lithography techniques have been proposed to make organic or inorganic display backplanes to reduce the cost and time for manufacturing of AMLCDs or active-matrix organic light-emitting diodes without using the conventional photolithography process.Imprint technology was first introduced by Chou in 1995, 2 but the first imprinting has many issues for the device fabrication process, for example, multilayer patterning, the need for high pressure, high coefficient of thermal expansion of resist materials, and formation of bubbles in the recessed region of a stamp. The imprinting technology has been improved to realize high resolution and a lowcost pattern formation method. UV imprinting was introduced to reduce the thermal expansion of imprint resist by Haisma in 1996, 3 and then the step and repeat method was introduced to improve uniformity. 4 Step-and-fresh imprint lithography was developed to reduce the bubble between the stamp and substrate for large-area processes by Sreenivasan in 1999. 5 A soft molding ͑SM͒ is one of the smart lithography methods using the soft mold material. The difference between microimprint lithography ͑MIL͒ and SM is that SM uses a soft elastomeric mold which absorbs the resist solvent or resist on the surface of a printed polymer layer with little or no pressure. 6 Molding processes such as micromolding in capillary, 7 microtransfer molding, 8 and solvent-assisted micromolding 9 have been introduced to improve the quality of patterning, but these methods could not solve the residual-layer problem. Combined nanoimprint and photolithography 10 and the imprint-photohybrid method 11 were introduced as zero residual-layer processes, but they require dry etching or solvent rinsing as a postprocess after the imprint or molding to remove the residual layer. In this paper we propose a MIL using the soft mold process with a modified substrate for a zero residual-layer process when forming micrometer-size patterns. The zero residual-layer process can be achieved by u...
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