The disinfection industry would greatly benefit from efficient, robust, high-power deep-ultraviolet light-emitting diodes (UV–C LEDs). However, the performance of UV–C AlGaN LEDs is limited by poor light-extraction efficiency (LEE) and the presence of a large density of threading dislocations. We demonstrate high power AlGaN LEDs grown on SiC with high LEE and low threading dislocation density. We employ a crack-free AlN buffer layer with low threading dislocation density and a technique to fabricate thin-film UV LEDs by removing the SiC substrate, with a highly selective SF6 etch. The LEDs (278 nm) have a turn-on voltage of 4.3 V and a CW power of 8 mW (82 mW/mm2) and external quantum efficiency (EQE) of 1.8% at 95 mA. KOH submicron roughening of the AlN surface (nitrogen-polar) and improved p-contact reflectivity are found to be effective in improving the LEE of UV light. We estimate the improved LEE by semiempirical calculations to be 33% (without encapsulation). This work establishes UV LEDs grown on SiC substrates as a viable architecture to large-area, high-brightness, and high-power UV LEDs.

We demonstrate very high luminous efficacy green light-emitting diodes employing Al_0.30Ga_0.70N cap layer grown on patterned sapphire substrates by metal organic chemical vapor deposition. The peak external quantum efficiency and luminous efficacies were 44.3% and 239 lm/w, respectively. At 20 mA (20 A/cm²) the light output power was 14.3 mW, the forward voltage was 3.5 V, the emission wavelength was 526.6 nm, and the external quantum efficiency was 30.2%. These results are among the highest reported luminous efficacy values for InGaN based green light-emitting diodes.

Crack-free AlN films with threading dislocation density (TDD) below 109 cm−2 are needed for deep-UV optoelectronics. This is typically achieved using pulsed lateral overgrowth or very thick buffer layers (>10 μm), a costly and time-consuming approach. A method for conventional metalorganic chemical vapor deposition growth of AlN/SiC films below 3 μm with greatly improved quality is presented. Focusing on substrate pretreatment before growth, we reduce average film stress from 0.9 GPa (tension) to −1.1 GPa (compression) and eliminate cracking. Next, with optimized growth conditions during initial deposition, AlN films with x-ray rocking curve widths of 123 arc-sec (0002) and 304 arc-sec (202¯1) are developed, and TDD is confirmed via plan view transmission electron microscopy (TEM) to be 2 × 108 cm−2. Film stress measurements including x-ray 2θ-ω, reciprocal space mapping, and curvature depict compressively stressed growth of AlN on 4H-SiC due to lattice mismatch. The thermal expansion coefficient mismatch between AlN and SiC is measured to be Δα=αAlN−αSiC=1.13×10−6 °C−1 and is found to be constant between room temperature and 1400 °C. TEM confirms the existence of dense misfit dislocation (MD) networks consistent with MD formation near SiC step edges and low MD density regions attributed to nearly coherent AlN growth on SiC terraces. These low-TDD, crack-free AlN/SiC buffers provide a platform for deep-UV optoelectronics and ultrawide bandgap electronics.

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The light output of deep ultraviolet (UV-C) AlGaN light-emitting diodes (LEDs) is limited due to their poor light extraction efficiency (LEE). To improve the LEE of AlGaN LEDs, we developed a fabrication technology to process AlGaN LEDs grown on SiC into thinfilm flip-chip LEDs (TFFC LEDs) with high LEE. This process transfers the AlGaN LED epi onto a new substrate by wafer-to-wafer bonding, and by removing the absorbing SiC substrate with a highly selective SF6 plasma etch that stops at the AlN buffer layer. We optimized the inductively coupled plasma (ICP) SF6 etch parameters to develop a substrateremoval process with high reliability and precise epitaxial control, without creating micromasking defects or degrading the health of the plasma etching system. The SiC etch rate by SF6 plasma was ~46 µm/hr at a high RF bias (400 W), and ~7 µm/hr at a low RF bias (49 W) with very high etch selectivity between SiC and AlN. The high SF6 etch selectivity between SiC and AlN was essential for removing the SiC substrate and exposing a pristine, smooth AlN surface. We demonstrated the epi-transfer process by fabricating high light extraction TFFC LEDs from AlGaN LEDs grown on SiC. To further enhance the light extraction, the exposed N-face AlN was anisotropically etched in dilute KOH. The LEE of the AlGaN LED improved by ~3X after KOH roughening at room temperature. This AlGaN TFFC LED process establishes a viable path to high external quantum efficiency (EQE) and power conversion efficiency (PCE) UV-C LEDs.

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The impact of AlGaN growth conditions on AlGaN:Si resistivity and surface morphology has been investigated using metalorganic chemical vapor deposition. Growth parameters including growth temperature, growth rate, and trimethylindium (TMI) flow have been systematically studied to minimize the resistivity of AlGaN:Si. We observed a strong anticorrelation between AlGaN:Si conductivity and growth temperature, suggesting increased silicon donor compensation at elevated temperatures. Secondary ion mass spectrometry and positron annihilation spectroscopy ruled out compensation by common impurities or group-III monovacancies as a reason for the observed phenomenon, in contrast to theoretical predictions. The underlying reason for AlGaN:Si resistivity dependence on growth temperature is discussed based on the possibility of silicon acting as a DX center in Al0.65Ga0.35N at high growth temperatures. We also show remarkable enhancement of AlGaN:Si conductivity by introducing TMI flow during growth. A minimum resistivity of 7.5 mΩ cm was obtained for n-type Al0.65Ga0.35N, which is among the lowest reported resistivity for this composition.

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