The effect of chitosan filled diglycidyl ether of bisphenol A (DGEBA) epoxy system were investigated using the thermal, mechanical, and morphological properties. The mixing ratio of resin/hardener was kept constant while the chitosan of 1.0, 2.5, 5.0, 7.5, and 10 weight percentage (wt%) was incorporated into the system. The thermal stability and the transition behaviour of the chitosan filled epoxy system were analysed through a differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and Fourier transform infrared spectroscopy (FTIR) while atomic force microscope (AFM) and scanning electron microscopy (SEM) were used to investigate the morphology. It was observed that the additive tends to agglomerate, with the formation of clear phase separation, when the chitosan content increases above 5 wt%. At lower chitosan loading (2.5 wt% and below), relatively uniform dispersion of the additive can be achieved. The thermal stability of the system increases with chitosan loading while the mechanical tensile strength is compromised.
Thermoplastic tapes have found a prominent place in automated tape placement (ATP), due to their reduced processing time. ATP also offers significant reduction in labour; however, the most attractive aspect is the use of its welding properties. Welding or diffusion bonding is necessary for two thermoplastic materials to bond to each other through the combined effect of heating and consolidation pressure. The work published in this article shows how various thermoplastic tape materials with different material properties are bonded to each other using a direct flame-type ATP process. Contact angle and differential scanning calorimetry measurements help understanding of the processing needs of the considered materials. The samples obtained after ATP are sent for peel testing using a wedge peel test principle, so that the force required to separate the bonding is identified. A T-peel test/pull test is also employed to cross-compare peel results obtained through wedge peel testing. The main aim of the work is to study the quality of connection between the two plies with different material interfaces and also how friction might contribute to peel force when wedge peeling is used. A numerical model is also implemented to show the effects of this friction.
This paper investigates the effects of polysaccharide additive agent on the morphological and thermal properties of thermosetting polymer. The weight percentage (wt%) of Diglycidyl Ether of Bisphenol A (DGEBA) epoxy resin to Hexamethylenediamine (HMDA) hardener were kept constant while a varyingwt% of chitosan, ranging from 0 to 10wt% was introduced. The chitosan filled epoxy hardener mixture was allowed to cure at 40°C for a period of 12 hours. Dynamic Scanning Calorimetry (DSC) and Thermal Gravimetric Analysis (TGA) were conducted on the specimens to analyse the effects of chitosan loading on thermal stability and transition temperature while Atomic Force Microscopy (AFM) was used to investigate the changes to its morphological property. At chitosan loading of 2.5wt% and below, good dispersion of the additive was observed. Apparent agglomeration and phase separation were formed when chitosan content increases above 7.5wt%. The formation of bulky chitosan agglomeration was found capable of enhancing the thermal stability of the thermoset polymer. The diamine acted as the co-reactants with DGEBA as well as spacer which decrease the effect of material brittleness due to addition of chitosan.
In this paper, the effect of varying mixing ratio of Diglycidyl ether of bisphenol A (DGEBA)/aliphatic amidoamine hardener on the behavior of dynamic cure profile and mechanical properties of the resulting thermoset was investigated. Epoxy/hardener sample with a stoichiometric mixing ratio of 2:1 are tested against non-stoichiometric ratios of 3:1 and 4:1. The tensile, flexural, and hardness properties of the specimens were measured while SEM is employed to investigate the fracture surface and analyze the failure. Results showed that epoxy enriched samples (non-stoichiometric) has a much brittle behavior and the DGEBA/hardener samples tend to fail under relatively small strain.
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