Thin film multilayers have previously been introduced on multilayer low temperature cofired ceramic (LTCC), as well as initial thin film capacitors on LTCC. The ruggedness of a multipurposeis a technology that has been readily adapted to many packaging applications, the varieties of which are expanding. In the RF area LTCC has been used for Multi-Chip Modules (MCM) involving additional capacitors and filters. Printed wiring boards are attractive due to the low cost and low dielectric constants for signal propagation, whereas LTCC has frequently been selected where material stability over special (harsh) environments is required. Soldering to LTCC involves a reaction with the thick film which is the adhesion layer -limiting the ruggedness and reworkability. Recently thin film materials on LTCC have been developed to improve not only the solder processing, but also the wire bond connectivity, good RF conductivity and highly increased ruggedness. Further thin film advantages are edges with nearvertical side walls (ion milling used for pattern creation) and bulk material properties. Methods to handle drawbacks (e.g. rough surface topography on vias mitigated by thick film cover pads) have been developed. This manuscript reports on the first full integration of thin film capacitors (Fig. 1) and filters on an LTCC MCM. Fig. 2).Full integration of thin film capacitors on LTCC is consistent with higher reliability and ruggedness of the entire MCMC system. Initial standalone test capacitors were designed to develop the PVD material deposition on LTCC as well as the electrode/dielectric synergy necessary for functional capacitors. Sputter deposition of the two electrodes and the dielectric layer were performed using
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