Surface mount technology (SMT) plays an important role in integrated circuits, but due to thermal stress alternation caused by temperature cycling, it tends to have thermo-mechanical reliability problems. At the same time, considering the environmental and health problems of lead (Pb)-based solders, the electronics industry has turned to lead-free solders, such as ternary alloy Sn-3Ag-0.5Cu (SAC305). As lead-free solders exhibit visco-plastic mechanical properties significantly affected by temperature, their thermo-mechanical reliability has received considerable attention. In this study, the interface delamination of an SMT solder joint using a SAC305 alloy under temperature cycling has been analyzed by the nonlinear finite element method. The results indicate that the highest contact pressure at the four corners of the termination/solder horizontal interface means that delamination is most likely to occur, followed by the y-direction side region of the solder/land interface and the top arc region of the termination/solder vertical interface. It should be noted that in order to keep the shape of the solder joint in the finite element model consistent with the actual situation after the reflow process, a minimum energy-based morphology evolution method has been incorporated into the established finite element model. Eventually, an Improved Efficient Global Optimization (IEGO) method was used to optimize the geometry of the SMT solder joint in order to reduce the contact pressure at critical points and critical regions. The optimization result shows that the contact pressure at the critical points and at the critical regions decreases significantly, which also means that the probability of thermal-induced delamination decreases.
Iron is a fundamental element required by most organisms, including Brucella. Several researchers have suggested that the iron response regulator (irr) and rhizobial iron regulator (rirA) genes regulate iron acquisition by Brucella abortus, influencing heme synthesis by and virulence of this pathogen. However, little is known about another Brucella species, Brucella melitensis. In this research, we successfully constructed two mutants: M5-90Δirr and M5-90ΔrirA. The adhesion, invasion, and intracellular survivability of these two mutants were evaluated in RAW264.7 cells infected with 1 × 106 CFU of M5-90Δirr, M5-90ΔrirA, or M5-90. We also tested the sensitivity of cells to hydrogen peroxide and their ability to grow. In addition, the virulence of these two mutants was evaluated in BALB/c mice. The results showed that the ability of these two mutants to invade and adhere inside the murine macrophages RAW264.7 was attenuated but their ability to replicate intracellularly was strengthened, enhancing the resistance to hydrogen peroxide. The M5-90Δirr mutant showed stronger growth ability than the parental strain under iron-limiting conditions. No differences were observed in the number of bacteria in spleen between M5-90 and M5-90Δirr at 7 or 15 days postinfection. However, the number of M5-90ΔrirA in spleen reduced significantly at 15 days postinfection. The splenic index of the M5-90Δirr group is evidently lower than that of M5-90. This is the first report that irr and rirA genes of B. melitensis are associated not only with virulence but also with growth ability. Together, our data suggest that M5-90Δirr is a promising Brucella vaccine candidate.
Isoprene is a typical physiological marker that can be used to screen for chronic liver disease (CLD). This work developed a portable micro-integrated chromatography analysis system based on micro-electromechanical system (MEMS) technology, nanomaterials technology and embedded microcontroller technology. The system integrated components such as graphene oxide quantum dots (GOQDs) modified semi-packed microcolumn, In2O3 nanoflower (NF) gas-sensitive detector and 3D printed miniature solenoid valve group. The effectiveness of the separation effect of the micro-integrated system was verified by gas mixture test; the laws of the influence of carrier gas pressure and column temperature on the chromatographic separation performance, respectively, were investigated, and the working conditions (column temperature 90 °C and carrier gas pressure 7.5 kPa) for system testing were determined. The percentages of relative standard deviation (RSD) of the peak areas and retention times obtained for the separated gases were in the range of 0.95% to 6.06%, indicating the good reproducibility of the system. Meanwhile, the microintegrated system could detect isoprene down to 50 ppb at small injection volume (1 mL). The system response increased with increasing isoprene concentration and was linearly correlated with isoprene concentration (R2 = 0.986), indicating that the system was expected to be used for trace detection of isoprene, a marker gas for liver disease, in the future.
Purpose Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages. Design/methodology/approach A 3D geometric model of SMT package is established. The mechanical properties of SMT solder joint under thermal cycling load and random vibration load were solved by 3D finite element analysis. The fatigue life of SMT solder joint under different loads can be calculated by using the modified Coffin–Manson model and high-cycle fatigue model. Findings The results revealed that cracks at different locations and propagation directions have different effect on the fatigue life of the SMT solder joint. From the location of the cracks, Crack 1 has the most significant impact on the thermal fatigue life of the solder joint. Under the same thermal cycling conditions, its life has decreased by 46.98%, followed by Crack 2, Crack 4 and Crack 3. On the other hand, under the same random vibration load, Crack 4 has the most significant impact on the solder joint fatigue life, reducing its life by 81.39%, followed by Crack 1, Crack 3 and Crack 2. From the crack propagation direction, with the increase of crack depth, the thermal fatigue life of the SMT solder joint decreases sharply at first and then continues to decline almost linearly. The random vibration fatigue life of the solder joint decreases continuously with the increase of crack depth. From the crack depth of 0.01 mm to 0.05 mm, the random vibration fatigue life decreases by 86.75%. When the crack width increases, the thermal and random vibration fatigue life of the solder joint decreases almost linearly. Originality/value This paper investigates the effects of interface cracks on the fatigue life and provides useful information on the reliability of SMT packages.
Brucella abortus are Gram-negative and facultative intracellular pathogens affecting humans and animals and can enter various cell types during infection [1]. Brucella penetrates the nasal cavity, oral cavity, and/or pharynx mucous membrane and is phagocytosed by host macrophages, in which they can survive and replicate.
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