wafer-scale, with good crystallinity and with contamination levels compatible with large-scale back-end-of-line (BEOL) integration. At present, chemical vapor deposition (CVD) on catalytic copper (Cu) substrates is widely recognized as the most promising route to obtain scalable monolayer graphene for electronic and optoelectronic applications. [1][2][3][4] However, significant hurdles are limiting the actual integration of CVD graphene grown on Cu for most applications. In the first instance, the unavoidable transfer process over wafer-scale is rather cumbersome and introduces contamination, unintentional doping, and mechanical stress, [5][6][7] which adversely impact the physical integrity and electrical performance [8] of the graphene layer. The significant challenge involved in carrying out this seemingly straightforward task is reflected by the vast literature on large-scale transfer processes. Second, metallic contamination levels in transferred CVD graphene grown on Cu are typically well-above the specifications requested for BEOL integration. [6] Clearly, asThe adoption of graphene in electronics, optoelectronics, and photonics is hindered by the difficulty in obtaining high-quality material on technologically relevant substrates, over wafer-scale sizes, and with metal contamination levels compatible with industrial requirements. To date, the direct growth of graphene on insulating substrates has proved to be challenging, usually requiring metal-catalysts or yielding defective graphene. In this work, a metal-free approach implemented in commercially available reactors to obtain high-quality monolayer graphene on c-plane sapphire substrates via chemical vapor deposition is demonstrated. Low energy electron diffraction, low energy electron microscopy, and scanning tunneling microscopy measurements identify the Al-rich reconstruction9° of sapphire to be crucial for obtaining epitaxial graphene. Raman spectroscopy and electrical transport measurements reveal high-quality graphene with mobilities consistently above 2000 cm 2 V −1 s −1 . The process is scaled up to 4 and 6 in. wafers sizes and metal contamination levels are retrieved to be within the limits for back-end-ofline integration. The growth process introduced here establishes a method for the synthesis of wafer-scale graphene films on a technologically viable basis.
Two-dimensional (2D) crystals have renewed opportunities in design and assembly of arti cial lattices without the constraints of epitaxy. However, the lack of thickness control in exfoliated van der Waals (vdW) layers prevents realization of repeat units with high delity. Recent availability of uniform, waferscale samples permits engineering of both electronic and optical dispersions in stacks of disparate 2D layers with multiple repeating units. We present optical dispersion engineering in a superlattice structure comprised of alternating layers of 2D excitonic chalcogenides and dielectric insulators. By carefully designing the unit cell parameters, we demonstrate > 90 % narrowband absorption in < 4 nm active layer excitonic absorber medium at room temperature, concurrently with enhanced photoluminescence in cm 2 samples. These superlattices show evidence of strong light-matter coupling and exciton-polariton formation with geometry-tunable coupling constants. Our results demonstrate proof of concept structures with engineered optical properties and pave the way for a broad class of scalable, designer optical metamaterials from atomically-thin layers.
2D materials have many outstanding properties that make them attractive for the fabrication of electronic devices, such as high conductivity, flexibility, and transparency. However, integrating 2D materials in commercial devices and circuits is challenging because their structure and properties can be damaged during the fabrication process. Recent studies have demonstrated that standard metal deposition techniques (like electron beam evaporation and sputtering) significantly damage the atomic structure of 2D materials. Here it is shown that the deposition of metal via inkjet printing technology does not produce any observable damage in the atomic structure of ultrathin 2D materials, and it can keep a sharp interface. These conclusions are supported by abundant data obtained via atomistic simulations, transmission electron microscopy, nano-chemical metrology, and device characterization in a probe station. The results are important for the understanding of inkjet printing technology applied to 2D materials, and they could contribute to the better design and optimization of electronic devices and circuits.
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