The product of nickel ions reduction in buffered solution by hypophosphite, known as Ni-P, was examined as a potentially useful material for thick film technology. This material, when mixed with glass oxidizes if heated above 450℃ in an air atmosphere. For this reason we investigated the possibility of using an additive to stabilize the Ni-P against oxidation. We found that B2O3as an additive showed itself to be most satisfactory. A detailed investigation of the phase relations in heated Ni-P, Ni-P-glass and Ni-P-glass-B2O3compositions was performed. The inks prepared so far from the mixture of Ni-P-glass-B2O3can only be used in thick film technology for conductor layer production (R□∿0.1Ω).The most satisfying and practically useful characteristics were obtained for inks produced from solid components containing 45 to 80 wt% Ni-P and about 10 wt% B2O3.
Thick Ni-P films have been widely investigated at our Institute. This article tends to visualize by use ofvarious microscopic methods how the growth and sintering of individual conducting grains, results in the formation of nickel dendrites responsible for the metallic character of electrical conduction.
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