In this paper, Robinson's analytical formulation is extended to calculate the shielding effectiveness of an shielding enclosure at off-axis observation points with an off-axis aperture. First, we give the procedure of extending the original analytical formulation. Then, the transmission-line matrix method (TLM) is utilized to validate the extended analytical formulation. The application range of the extended method is decided by comparing to TLM, and the good agreement between the results calculated by two methods indicates that the extended analytical formulation is efficient in predicting the shielding effectiveness of an enclosure at different observation points with an off-axis aperture. Through the intensive calculation and analysis, the distribution of SE inside the enclosure and the variation of SE with aperture position can be obtained, which may be used as a guideline for designing shielding enclosures.
High-frequency characteristics of passive components are crucial to the electromagnetic compatibility (EMC) of an electronic system, and modeling of passive components is of significance for EMC analysis. However, challenges remain in the modeling of passive components with multiple resonant frequencies. In this paper, a method for establishing equivalent models of multiresonant frequency passive components, including capacitors, inductors, and resistors, is proposed. Firstly, high-frequency equivalent circuit topologies of the multi-resonant frequency passive components, which are simple, easy to understand, and can be applied to the modeling of passive components with various impedance characteristics, are developed. Secondly, a calculation method of equivalent circuit parameters based on least squares and particle swarm optimization (PSO) is presented, which is not sensitive to the initial value, only needs the estimated range of the equivalent circuit parameters, and very suitable for getting the parameters of equivalent circuit models accurately and efficiently. Finally, to validate the method, some SPICE models of single components are established, and a PCB-level EMC analysis is implemented. The comparisons of the simulated and experimental results show the validity and accuracy of the method. The method is very useful for future components modeling when doing EMC design or other high-frequency designs.
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