Currently, there are two major drivers for moderately high operating temperature (HOD electronics in the 135 -200°C range. Products with signifcant heat generation such as power electronics or small, sophisticated portable electronics without space for cooling mechanismsprovide a large market segment in the low end of this temperature range. For these applications, a packaging technology with substantially improved thermal dissipation may be sufficient to allow the continued use of standard components, albeit at slightly derated performance leveLThe upper end of the temperature regime is represented by products that are placed into a HOT environment such as distributed sensors and control systems. Typically these products are for high volume applications such as automotive underhood and industrial uses. In this market segment, cost is the most critical issue followed by form factors. The HOT components primarily control the cost, but the form factors and the residual costs can be addressed by the use of new packaging concepts. Form factors are critical because often there is little room for the control modules at the sensor/actuator site, let alone cooling systems, and mounting of heavy modules or those subject to vibration damage is disficult to achieve without substantial re-design of the overall product. Use of polymers for packaging in these applications is typically hampered by the low thermal conductivity and thermal degradation resistance of polymeric materials used in lowcost laminate printed wiring board (PUB)technology. As a further challenge, HOT applications generally require exposure to somewhat rigorous thermal cycling for power up and down, as well as environmental exposure. Classes of polymeric materials appropriate for the various aspects of electronic packaging at moderately high operating temperatures and through -55 "c to 4-22.5 "C cycling will be discussed In addition, a new electronic (0-7803-4437-5/98/$10.00 1998 IEEE) packaging technology which employs some of the elements of laminate, except that the circuits are directly deposited onto insulated metal substrates will be presented This packaging has several fold better thermal conductivity than conventional ceramic or polyimide glued-to-heat-sink HOT packaging, is more mechanically robust than ceramic, is lightweight and compact and can be deposited on 3dimensional surfaces to minimize space requirements. Multilayer circuits with dimensions as small as 5 0 p lines and spaces and 7 5 p vias are possible, as well as large dimension circuits for power applications. This approach is also more cost effective than conventional HOT packaging.
Currently, there are two major drivers for lightweight and compact and can be deposited on 3-moderately high operating temperature (HOT) dimensional surfaces to minimize space electronics in the 135 -200°C range. Products with requirements. Multilayer circuits with dimensions significant heat generation such as power electronics as small as 50pm lines and spaces 75pm vias are or small, sophisticated portable electronics without possible as well as large dimension circuits for space for cooling mechanisms provide a large power applications. This approach is also more market segment in the low end of this temperature cost effective than conventional HOT packaging. range.For these applications, a packaging technology with substantially improved thermal dissipation may be sufficient to allow the continued use of standard components, albeit at slightly derated performance level. The second driver is products that are placed into a HOT environment such as distributed sensors and control systems. Typically these products are for high volume applications such as automotive underhood and industrial uses and they experience the upper end of the moderately HOT range. In this market segment, cost is the most critical issue followed by form factors. The HOT components primarily control the cost, but the form factors and the residual costs can be addressed by the use of new packaging concepts. Form factors are critical because often there is little room for the control modules at the sensor/actuator site let alone cooling systems, and mounting of heavy modules or those subject to vibration damage is difficult to achieve without substantial re-design of the overall product.We have developed an electronic packaging technology in which the circuits are directly deposited onto insulated metal substrates. This packaging has several fold better thermal conductivity than conventional ceramic or polyimide glued-to-heat-sink HOT packaging, is more mechanically robust than ceramic, is 0-7803-4540-1/98/$10.00 0 1998 IEEE 93
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