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Aims to show that with careful modelling, the fatigue life of solder joints of identical geometry and microstructure can be predicted very accurately (through empirical correlations) under different environmental test or field use conditions. Here, on the TI 144 chip ‐scale package, the empirical correlation for fatigue life developed under thermal cycling conditions is used to predict the life under power cycling. This accurate model has served as the physical basis which in to demonstrate quantitatively the equivalence of thermal cycling and power cycling as valid accelerated life tests. Describes the great importance of spatial refinement, temporal refinement, and accurate boundary conditions, including the often ignored natural convection boundary conditions, and their effect on predicted life.

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