Depth dependence of elastic grain interaction and mechanical stress: Analysis by x-ray diffraction measurements at fixed penetration/information depths J. Appl. Phys. 100, 114904 (2006); 10.1063/1.2363899 X-ray diffraction study of residual stresses and microstructure in tungsten thin films sputter deposited on polyimide J.Residual stress, microstructure, and structure of tungsten thin films deposited by magnetron sputtering A procedure for determining the residual stress in thin films using energy dispersive x-ray diffraction was investigated. The effect of the sputtering pressure on the residual stress in dc magnetron sputtered Ni films was studied in greater detail using this approach. The behavior reported suggested the possibility of controlling or influencing the sign and/or magnitude of the residual stress. In addition, the stress variation with increasing negative bias voltage is also presented. In the range studied, between Ϫ15 and Ϫ150 V, residual stress is always tensile.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.