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This paper reports the design and manufacture of three differing types of resistive strain sensitive structures fabricated using the Conductive Lithographic Film (CLF) printing process. The structures, utilising two inks prepared with silver and graphite particulates as the conductive phase, have been analysed to determine electrical and mechanical properties with respect to strain, temperature and humidity when deposited on four alternative substrate materials (GlossArt, PolyArt, Teslin and Melinex).

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Conductive lithographic films (CLF) are an emerging fabrication process for electronic interconnect and a range of passive component structures. This paper reviews the manufacture, properties and applications of CLF conductors, and discusses other lithographically deposited electronic materials including resistive, dielectric and ferrite films. Recent developments in CLF technology, including multilayer structures and concurrent printing of interconnect with printed passive components, are presented.