This article provides an in-depth overview of thermal heat sink design and optimization. Heat transfer enhancement strategies are discussed in detail, followed by fin design trends and geometries, and a discussion on different fin configurations and their merits is also presented. Important results and findings of experiments concerning the design and optimization of fin geometries have been summarized. For complex heat dissipation applications, researchers have been studying different fin arrangements especially, inclined fins, to maximize the performance of the heat sinks. Along with innovative fin designs, microchannels for heat dissipation are gaining attention due to their. Recent advances in this domain have been discussed. New components are becoming more compact and advanced as a result of technological breakthroughs in electronics and control systems; hence, the use and optimization of heat sinks for modern applications are also discussed in this article.
Heat Sinks are widely used to remove the heat from the components which are generating heat during their functioning. Overheating causes malfunctioning of the components as well as it is responsible for reducing their life. Free convection is very common way of heat transfer from the heat sink considering power requirement, pressure drop and cost of the forced convection. This paper presents the thermal analysis of vertical plate fin heat sink by theoretical and experimental method at variable heat input. The results are obtained by taking experimental observations and are validated with already existing correlations suggested by various researchers in the literature.
Heat sinks are popularly used in various industrial applications to cool electrical, electronics and automobile components. They are useful in removing the heat from the surfaces at elevated temperatures. The life of such devices depends on their operating temperature. Heat sinks are important parts of thermal management systems of most of these devices eg: Diods, thyristers, high power semiconductor devices such as integrated circuits of inverters, audio amplifier, microprocessors, microcontrollers etc. In many situations where heat transfer is by free convection where convective heat transfer coefficient is low, fins are the best solution because of their less cost and trouble free operation. The weight and size of equipment are the most important parameters of design. Present day demand, the use of compact systems in every application which leads to higher packing density. The failure rate of electronic equipments increase exponentially with the temperature. Also the high thermal stresses in the solder joints of electronic components mounted on circuit boards resulting from temperature variation are major causes of failure. Therefore thermal control has become an important factor in the design and operation of electronic equipment. The most preferred method for cooling these systems is passive cooling because it is cost effective and reliable. This leads to focus on development of effective fin heat sink. To make heat sink effective, geometry and orientation of the heat sink as well as heat transfer augmentation techniques plays important role. This paper highlights the use of heat sinks in electronic cooling applications and review of related literature of improving the heat transfer performance of plate fin heat sinks by surface modifications, interrupting the boundary layer and changing the orientation.
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