An atomic description of water dynamics and electrochemical properties at electrode-electrolyte interfaces is presented using molecular dynamics with the third generation of the charge-optimized many-body (COMB3) potential framework. Externally applied potentials in electrochemical applications were simulated by offsetting electronegativity on electrode atoms. This approach is incorporated into the variable charge scheme within COMB3 and is used to investigate electrochemical systems consisting of two Cu electrodes and a water electrolyte with varying concentrations of hydroxyls (OH) and protons (H). The interactions between the electronegativity offset method and the charge equilibration method in a variable charge scheme are analyzed. In addition, a charge equilibration method for electrochemical applications is proposed, where the externally applied potentials are treated by the electronegativity offset on the electrodes thus enforcing charge neutrality on the electrolyte. This method is able to qualitatively capture the relevant electrochemistry and predict consistently correct voltages with precalibration.

The interaction of liquid water with Pt(111) is investigated with classical molecular dynamics (MD) simulations, where the forces are determined using the third-generation charge optimized many-body (COMB3) interatomic potential. In cases of sub-monolayer water coverage, the parameterized empirical potential predicts experimentally observed and energetically favorable √37 and √39 reconstructed water structures with "575757" di-interstitial defects. At both sub-monolayer and multilayer water coverages, the structure of the first wetting layer of liquid water on Pt(111) exhibits a characteristic distribution where the molecules form two distinct buckled layers as a result of the interplay between water-metal adsorption and water-water hydrogen bonds. The dynamic spreading rate of water nanodroplets on large Pt surfaces (>200 nm) characterized by molecular kinetic spreading theory is an order of magnitude slower than the molecular kinetic rate of the same droplet on close-packed Cu surfaces due to variation in molecular distributions at the water-metal interface. These nanoscale MD simulation predictions using the COMB3 interatomic potential demonstrate the capability of capturing both many-body interactions between HO and Pt or Cu and hydrogen bonding in liquid water.

The interfacial dynamics of water in contact with bare, oxidized, and hydroxylated copper surfaces are examined using classical molecular dynamics (MD) simulations. A third-generation charge-optimized many-body (COMB3) potential is used in the MD simulations to investigate the adsorption of water molecules on Cu(111), and the results are compared to the findings of density functional theory (DFT) calculations. The adsorption energies and structures predicted by COMB3 are generally consistent with those determined with DFT. The COMB3 potential is then used to investigate the wetting behavior of water nanodroplets on Cu(111) at 20, 130, and 300 K. At room temperature, the simulations predict that the spreading rate of the base radius, R0, of a water droplet with a diameter of about 1.5 nm exhibits a spreading rate of R0 ≈ t(0.16) and a final base radius of 3.5 nm. At 20 and 130 K, water droplets are predicted to retain their structure after adsorption on Cu(111) and to undergo minimal spreading in agreement with scanning tunneling microscopy data. When the same water droplet encounters a reconstructed, oxidized Cu(111) surface, the classical MD simulations predict wetting with a spreading rate of R ≈ t(0.14) and a final base radius of 3.0 nm. Similarly, our MD simulations predict a spreading rate of R ≈ t(0.14) and a final base radius of 2.5 nm when water encounters OH-covered Cu(111). These results indicate that oxidation and hydroxylation cause a reduction in the degree of spreading and final base radius that is directly associated with a decreased spreading rate for water nanodroplets on copper.

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