Tapping mode atomic force microscopy (AFM) is employed for dynamic plowing lithography of exfoliated graphene on silicon dioxide substrates. The shape of the graphene sheet is determined by the movement of the vibrating AFM probe. There are two possibilities for lithography depending on the applied force. At moderate forces, the AFM tip only deforms the graphene and generates local strain of the order of 0.1%. For sufficiently large forces the AFM tip can hook graphene and then pull it, thus cutting the graphene along the direction of the tip motion. Electrical characterization by AFM based electric force microscopy, Kelvin probe force microscopy and conductive AFM allows us to distinguish between the truly separated islands and those still connected to the surrounding graphene.
In this work, we present a fully atomistic approach to modeling a finishing process with the goal to shed light on aspects of work piece development on the microscopic scale, which are difficult or even impossible to observe in experiments, but highly relevant for the resulting material behavior. In a large-scale simulative parametric study, we varied four of the most relevant grinding parameters: The work piece material, the abrasive shape, the temperature, and the infeed depth. In order to validate our model, we compared the normalized surface roughness, the power spectral densities, the steady-state contact stresses, and the microstructure with proportionally scaled macroscopic experimental results. Although the grain sizes vary by a factor of more than 1,000 between experiment and simulation, the characteristic process parameters were reasonably reproduced, to some extent even allowing predictions of surface quality degradation due to tool wear. Using the experimentally validated model, we studied time-resolved stress profiles within the ferrite/steel work piece as well as maps of the microstructural changes occurring in the near-surface regions. We found that blunt abrasives combined with elevated temperatures have the greatest and most complex impact on near-surface microstructure and stresses, as multiple processes are in mutual competition here.
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