A thermal heat switch has been developed intended for cryogenic space applications operating around 100 K. The switch was designed to separate two pulse tube cold heads that cool a common focal plane array. Two cold heads are used for redundancy reasons, while the switch is used to reduce the thermal heat loss of the stand-by cold head, thus limiting the required input power, weight and dimensions of the cooler assembly. After initial evaluation of possible switching technologies, a construction based on the difference in the linear thermal expansion coefficients (CTE) of different materials was chosen. A simple design is proposed based on thermoplastics which have one of the highest CTE known permitting a relative large gap width in the open state. Furthermore, the switch requires no power neither during normal operation nor for switching. This enhances reliability and allows for a simple mechanical design. After a single switch was successfully built, a second double-switch configuration was designed and tested. The long term performance of the chosen thermoplastic (ultra-high molecular weight polyethylene) under cryogenic load is also analysed.
A previously designed cryogenic thermal heat switch for space applications has been optimized for low mass, high structural stability, and reliability. The heat switch makes use of the large linear thermal expansion coefficient (CTE) of the thermoplastic UHMW-PE for actuation. A structure model, which includes the temperature dependent properties of the actuator, is derived to be able to predict the contact pressure between the switch parts. This pressure was used in a thermal model in order to predict the switch performance under different heat loads and operating temperatures. The two models were used to optimize the mass and stability of the switch. Its reliability was proven by cyclic actuation of the switch and by shaker tests.
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