As one of the various attempts to reduce the size of display bezel, highprecision glass cutting process is required to be developed for future displays.In this study, the Bessel-beam Laser Cutting (BLC) process has been studied, which is capable of minimizing the thermal deformation of the black matrix (BM) material on glass. In an experimental setup composed of IR ps laser with bessel-beam optics, the smallest thermal degradation of BM and the highest cutting precision are achieved as 40 and 10 μm, respectively. When reducing thermal effects caused by high-order beams without sacrificing glass breaking strength, effective heat affected zone (HAZ) could be reduced nearby 30 μm width from the cutting line. This high-precision cutting technology will contribute to realize extremely narrow bezel display near future.
Requirements on glass manufacturing with exceptionally high mechanical strength triggered development of new laserbased processing methods. Localized modifications produced by ultrashort pulsed lasers are attractive but may lead to micro-crack generation in glass. Aiming to control stresses during volumetric material modifications, we have studied the effect of pulse duration experimentally. Bessel beam shapes with arbitrary conical angles have been generated using a programmable spatial light modulator (SLM), while stresses have been monitored using time-resolved optical transmission and cross polarized microscopy. Pulse duration variation influences mechanical stress in the laser glass interaction, and we found the optimized pulse duration exists in the laser glass machining by pump-probe microscopy.
As one of the various attempts to reduce the size of display bezel, high‐precision glass cutting process is required to be developed for future displays. In this study, the Bessel‐beam Laser Cutting (BLC) process has been studied, which is capable of minimizing the thermal deformation of the black matrix (BM) material on glass. In an experimental setup composed of IR ps laser with bessel‐beam optics, the smallest thermal degradation of BM and the highest cutting precision are achieved as 40μm and 10μm, respectively. When reducing thermal effects caused by high‐order beams without sacrificing glass breaking strength, effective heat affected zone (HAZ) could be reduced nearby 30um width from the cutting line. This high precision cutting technology will contribute to realize extremely narrow bezel display near future.
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