Plasma treatment is increasingly being explored as an effective presowing treatment improving seed germination. This study examines the synergetic effect of the irrigation condition and the physicochemical surface properties of wheat seeds subjected to atmospheric dielectric barrier discharge plasma activation on their water uptake and germination. Extensive surface analysis revealed a remarkably enhanced wettability of plasma‐treated seeds due to the insertion of oxygen‐containing functionalities on their surface. However, long plasma exposures damaged the outermost layers of the pericarp due to a pronounced oxidative etching effect. Although the seed germination capacity was not affected by the plasma treatments, short plasma exposures were shown to enhance water uptake and accelerate seed germination, especially under water‐scarcity conditions.