Literature data on the thermal conductivity of commercially Dure aluminum, copper, iron, and tunqsten specimens have been collected, coded, critically analyzed, and correlated with analytical techniques based on theoretical and empirical equations. The resulting functions are presented and used to qenerate tables and graphs of thermal conductivity as a function of temperature and residual resistivity ratio (RRR). An annotated biblioqraphy of references is included. Discussions are included on the variations in thermal conductivity caused by chemical impurities, physical defects, size effects, and maqnetic fields. Smoothed values are presented for temperatures from 1 K to near the melting point and for a large ranqe of RRR val ues.
This document describes the measurement effort that has occurred since the establishment of these SRM's. New data are presented and, based on these, changes in the recommended values are described. The new recommended values are presented in the form of equations, graphs, and tables. The temperature ranges included are: 2 to 1000 K for electrolytic iron, 2 to 3000 K for tungsten, and 2 to 1200 K for stainless steel.
XRD has been found to be a useful technique for investigating both surface and interior stresses in. adhesive bonded joints. For the interior stresses, to gain access to the joint interface, adherends were chosen such that one adherend was relatively transparent to the X-radiation used and the other was not. Incident X-rays then penetrated the first adherend and the adhesive, and were diffracted from just below the surface of the second adherend.In prior work it was shown that the measured stresses due to an applied load agreed quite well with stresses calculated for the same joint using the TEXGAP-2D finite element program, except at one extremity of the bond. One explanation proposed for the discrepancy was that a small debond was present at this extremity. In the present study, therefore, an investigation was made of a joint contfli'nitig an intentional debond at this extremity.
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