High-impedance surfaces (HIS) comprising lossy frequency selective surfaces (FSS) are employed to design thin electromagnetic absorbers. The structure, despite its typical resonant behavior, is able to perform a very wideband absorption in a reduced thickness. Losses in the frequency selective surface are introduced by printing the periodic pattern through resistive inks and hence avoiding the typical soldering of a large number of lumped resistors. The effect of the surface resistance of the FSS and dielectric substrate characteristics on the input impedance of the absorber is discussed by means of a circuital model. It is shown that the optimum value of surface resistance is affected both by substrate parameters (thickness and permittivity) and by FSS element shape. The equivalent circuit model is then used to introduce the working principles of the narrowband and the wideband absorbing structure and to derive the best-suited element for wideband absorption

A frequency selective radome is presented, acting as a pass band filter at a given frequency band, while behaving as an absorber above the transmission band. The pass band behavior is obtained by a metallic FSS realized through a compact interdigitated Jerusalem cross element characterized by a very large rejection band. The metallic FSS is used as the ground plane of a thin wideband absorber based on resistive high-impedance surfaces within the total reflection band. The outer absorber reduces the signature of the antenna system when the radome is illuminated by out of band signals. The resistive FSS which comprises the absorber is designed so to minimize losses within the transmitting band of the radome. The composite structure is thoroughly analyzed by an efficient equivalent circuit approach and by full-wave numerical simulations

The transmission and reflection properties of frequency-selective surfaces (FSSs) are evaluated through a simple and accurate first-order circuit approach. The approximate analysis, based on the parallel between real structure and a lumped-LC-network counterpart, is also useful for acquiring physical insights into the working principles of frequency-selective surfaces. The first part of the paper describes a technique for computing lumped parameters of the most common frequency-selective-surface elements. The L and C parameters representing a given frequency-selective-surface element are derived only one time, at normal incidence, and stored, so as to form a database. The second part of the paper deals with the derivation of simple relations allowing the generalization of the stored LC couples in the case where the frequency-selective surface is printed or embedded in arbitrarily thick dielectric slabs, when the incident angle is varied from normal incidence, or if a different periodicity with respect to the reference periodicity is adopted. The generalized lumped parameters are included in an equivalent transmission line for computing the response of generic frequency-selective-surface configurations with no additional computational effort. The results obtained through the simplified model presented here are verified by a careful comparison with MoM simulations

In this paper a planar electromagnetic absorber is introduced whose performance is maintained over a wide change of the incidence angle for both TE and TM polarization. The absorber comprises an array of patches over a grounded dielectric slab, with clear advantage in terms of manufacturability. It is shown that a high value of the relative permittivity of the substrate is essential for the operation of the absorber. The main contribution of the paper is to demonstrate and practically use the presence of an additional resonance of highimpedance surfaces when the plasma frequency of the wire medium comprising metallic vias in the dielectric substrate is close to the original resonance of the high-impedance surface. The presence of the vias between FSS and the ground plane is discussed both for the case of a high-permittivity absorber and for a low permittivity one. The radius of the vias influences the oblique incidence TM absorption, and when properly designed, the insertion of the vias result in bandwidth enlargement and higher absorption.

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