Bulk MoS 2 , a prototypical layered transition-metal dichalcogenide, is an indirect band gap semiconductor. Reducing its size to a monolayer, MoS 2 undergoes a transition to the direct band semiconductor. We support this experimental observation by first principles calculations and show that quantum confinement in layered d-electron dichalcogenides results in tuning the electronic structure at the nanoscale. We further studied the properties of related TmS 2 nanolayers (Tm = W, Nb, Re) and show that the isotopological WS 2 exhibits similar electronic properties, while NbS 2 and ReS 2 remain metallic independent on size.
Quantum conductance calculations on the mechanically deformed monolayers of MoS 2 and WS 2 were performed using the non-equlibrium Green's functions method combined with the Landauer-Büttiker approach for ballistic transport together with the density-functional based tight binding (DFTB) method. Tensile strain and compression causes significant changes in the electronic structure of TMD single layers and eventually the transition semiconductor-metal occurs for elongations as large as 11% for the 2D-isotropic deformations in the hexagonal structure. This transition enhances the electron transport in otherwise semiconducting materials.
The stacking orders in layered hexagonal boron nitride bulk and bilayers are studied using high-level ab initio theory [local second-order Møller-Plesset perturbation theory (LMP2)]. Our results show that both electrostatic and London dispersion interactions are responsible for interlayer distance and stacking order, with AA' being the most stable one. The minimum energy sliding path includes only the AA' high-symmetry stacking, and the energy barrier is 3.4 meV per atom for the bilayer. State-of-the-art density functionals with and without London dispersion correction fail to correctly describe the interlayer energies with the exception of a Perdew-Burke-Ernzerhof functional intended for solid state and surface systems that agrees very well with our LMP2 results and experiment.
Covalent-Organic Frameworks (COFs) are a new family of 2D and 3D highly porous and crystalline materials built of light elements, such as boron, oxygen and carbon. For all 2D COFs, an AA stacking arrangement has been reported on the basis of experimental powder XRD patterns, with the exception of COF-1 (AB stacking). In this work, we show that the stacking of 2D COFs is different as originally suggested: COF-1, COF-5, COF-6 and COF-8 are considerably more stable if their stacking arrangement is either serrated or inclined, and layers are shifted with respect to each other by ~1.4 Å compared with perfect AA stacking. These structures are in agreement with to date experimental data, including the XRD patterns, and lead to a larger surface area and stronger polarisation of the pore surface.
Two-dimensional
(2D) layered materials are ideal for micro- and
nanoelectromechanical systems (MEMS/NEMS) due to their ultimate thinness.
Platinum diselenide (PtSe2), an exciting and unexplored
2D transition metal dichalcogenide material, is particularly interesting
because its low temperature growth process is scalable and compatible
with silicon technology. Here, we report the potential of thin PtSe2 films as electromechanical piezoresistive sensors. All experiments
have been conducted with semimetallic PtSe2 films grown
by thermally assisted conversion of platinum at a complementary metal–oxide–semiconductor
(CMOS)-compatible temperature of 400 °C. We report high negative
gauge factors of up to −85 obtained experimentally from PtSe2 strain gauges in a bending cantilever beam setup. Integrated
NEMS piezoresistive pressure sensors with freestanding PMMA/PtSe2 membranes confirm the negative gauge factor and exhibit very
high sensitivity, outperforming previously reported values by orders
of magnitude. We employ density functional theory calculations to
understand the origin of the measured negative gauge factor. Our results
suggest PtSe2 as a very promising candidate for future
NEMS applications, including integration into CMOS production lines.
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