An electronic skin (e-skin) for the next generation of robots is expected to have biological skin-like multimodal sensing, signal encoding, and preprocessing. To this end, it is imperative to have high-quality, uniformly responding electronic devices distributed over large areas and capable of delivering synaptic behavior with long- and short-term memory. Here, we present an approach to realize synaptic transistors (12-by-14 array) using ZnO nanowires printed on flexible substrate with 100% yield and high uniformity. The presented devices show synaptic behavior under pulse stimuli, exhibiting excitatory (inhibitory) post-synaptic current, spiking rate-dependent plasticity, and short-term to long-term memory transition. The as-realized transistors demonstrate excellent bio-like synaptic behavior and show great potential for in-hardware learning. This is demonstrated through a prototype computational e-skin, comprising event-driven sensors, synaptic transistors, and spiking neurons that bestow biological skin-like haptic sensations to a robotic hand. With associative learning, the presented computational e-skin could gradually acquire a human body–like pain reflex. The learnt behavior could be strengthened through practice. Such a peripheral nervous system–like localized learning could substantially reduce the data latency and decrease the cognitive load on the robotic platform.

Transfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orientation, etc.) and transfer yield (∼95%). The silicon NR based field-effect transistors printed using direct roll transfer consistently show high performance i.e., high on-state current (Ion) >1 mA, high mobility (μeff) >600 cm2/Vs, high on/off ratio (Ion/off) of around 106, and low hysteresis (<0.4 V). The developed versatile and transformative method can also print nanostructures based on other materials such as GaAs and thus could pave the way for direct printing of high-performance electronics on large-area flexible substrates.

The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

Touch is a complex sensing modality owing to large number of receptors (mechano, thermal, pain) nonuniformly embedded in the soft skin all over the body. These receptors can gather and encode the large tactile data, allowing us to feel and perceive the real world. This efficient somatosensation far outperforms the touch-sensing capability of most of the state-of-the-art robots today and suggests the need for neural-like hardware for electronic skin (e-skin). This could be attained through either innovative schemes for developing distributed electronics or repurposing the neuromorphic circuits developed for other sensory modalities such as vision and audio. This Review highlights the hardware implementations of various computational building blocks for e-skin and the ways they can be integrated to potentially realize human skin–like or peripheral nervous system–like functionalities. The neural-like sensing and data processing are discussed along with various algorithms and hardware architectures. The integration of ultrathin neuromorphic chips for local computation and the printed electronics on soft substrate used for the development of e-skin over large areas are expected to advance robotic interaction as well as open new avenues for research in medical instrumentation, wearables, electronics, and neuroprosthetics.

Flexible multifunctional sensors on skin or wearables are considered highly suitable for next-generation noninvasive health care devices. In this regard, the field-effect transistor (FET)-based chemical sensors such as ion-sensitive FETs (ISFETs) are attractive as, with the ultrathin complementary metal oxide semiconductor technology, they can enable a flexible or bendable sensor system. However, the bending-related stress or strain could change the output of devices on ultrathin chips (UTCs), and this has been argued as a major challenge hindering the advancement and use of this technology in applications such as wearables. This may not be always true, as with drift-free ISFETs, we show that bending could also enhance the performance of UTCs. Through fine control of bending radius in the micrometer scale, the mechanically flexible RuO 2 -based ISFETs on UTCs (44.76 μm thickness) are shown to reproducibly enhance the performance even after 1000 bending cycles. The 1.3 orders of magnitude improved stability (the drift rate changed from −557 nA/min to −28 ± 0.16 nA/min) is observed over a time period of 417.3 s (∼7 min) at fixed biasing and temperature conditions and under different pH conditions. Finally, a compact macromodel is developed to capture the bending-induced improvements in flexible ISFETs. The performance enhancement by controlled bending of devices could generally benefit the rapidly growing field of flexible electronics.