Nearly a century of research on enhancing critical heat flux (CHF) has focused on altering the boiling surface properties such as its nucleation site density, wettability, wickability and heat transfer area. But, a mechanism to manipulate dynamics of the vapor and liquid interactions above the boiling surface as a means of enhancing CHF has not been proposed. Here, a new approach is implemented to limit the vapor phase lateral expansion over the heat transfer surface and actively control the surface wetted area fraction, known to decline monotonically with increasing heat flux. This new degree of freedom has enabled reaching unprecedented CHF levels and revealed new details about the physics of CHF. The impact of wickability, effective heat transfer area, and liquid pressure on CHF is precisely quantified. Test results show that, when rewetting is facilitated, the CHF increases linearly with the effective surface heat transfer area. A maximum CHF of 1.8 kW/cm 2 was achieved on a copper structure with the highest surface area among all tested surfaces. A model developed based on the experimental data suggests that the thermal conductivity of the surface structures ultimately limits the CHF; and a maximum CHF of 7-8 kW/cm 2 may be achieved using diamond surface structures.Boiling is a ubiquitous mechanism of heat transfer with numerous applications ranging from small-scale HVAC and refrigeration systems used in most buildings to large boilers in energy and process industries. Due to its unique performance characteristics, boiling has been implemented in extremely demanding applications such as fusion reactors 1-3 . The ebullition process in boiling triggers a set of heat and mass transfer events that can generate extremely high local cooling rates [4][5][6] . As such, in response to demands for removing heat from confined spaces in modem applications [7][8][9][10]

Performance enhancement of the two-phase flow boiling heat transfer process in microchannels through implementation of surface micro- and nanostructures has gained substantial interest in recent years. However, the reported results range widely from a decline to improvements in performance depending on the test conditions and fluid properties, without a consensus on the physical mechanisms responsible for the observed behavior. This gap in knowledge stems from a lack of understanding of the physics of surface structures interactions with microscale heat and mass transfer events involved in the microchannel flow boiling process. Here, using a novel measurement technique, the heat and mass transfer process is analyzed within surface structures with unprecedented detail. The local heat flux and dryout time scale are measured as the liquid wicks through surface structures and evaporates. The physics governing heat transfer enhancement on textured surfaces is explained by a deterministic model that involves three key parameters: the drying time scale of the liquid film wicking into the surface structures (τd), the heating length scale of the liquid film (δH) and the area fraction of the evaporating liquid film (Ar). It is shown that the model accurately predicts the optimum spacing between surface structures (i.e. pillars fabricated on the microchannel wall) in boiling of two fluids FC-72 and water with fundamentally different wicking characteristics.

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Expanded polytetrafluoroethylene (ePTFE) nanofibrous membranes exhibit high porosity (80%–90%), high gas permeability, chemical inertness, and superhydrophobicity, which makes them a suitable choice in many demanding fields including industrial filtration, medical implants, bio-/nano- sensors/actuators and microanalysis (i.e. lab-on-a-chip). However, one of the major challenges that inhibit implementation of such membranes is their inability to bond to other materials due to their intrinsic low surface energy and chemical inertness. Prior attempts to improve adhesion of ePTFE membranes to other surfaces involved surface chemical treatments which have not been successful due to degradation of the mechanical integrity and the breakthrough pressure of the membrane. Here, we report a simple and scalable method of bonding ePTFE membranes to different surfaces via the introduction of an intermediate adhesive layer. While a variety of adhesives can be used with this technique, the highest bonding performance is obtained for adhesives that have moderate contact angles with the substrate and low contact angles with the membrane. A thin layer of an adhesive can be uniformly applied onto micro-patterned substrates with feature sizes down to 5 µm using a roll-coating process. Membrane-based microchannel and micropillar devices with burst pressures of up to 200 kPa have been successfully fabricated and tested. A thin layer of the membrane remains attached to the substrate after debonding, suggesting that mechanical interlocking through nanofiber engagement is the main mechanism of adhesion.

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