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Nowadays, multi-functional materials are strongly needed to meet the requirements of next-generation electronic devices. In this work, two different nanostructured fillers, reduced graphene oxide (RGO) and nanoalumina, were chosen to study their effect on the thermal, electrical and mechanical properties of the prepared epoxy composites at different loadings (0.5 to 2 wt%). RGO was firstly prepared and characterized by XRD, Raman spectroscopy and TEM confirming its production. The results revealed that RGO showed excellent adhesion with the polymer. Whilst, alumina aggregated and debonded from the matrix, as confirmed by SEM images. Hence, at only 2 wt%, RGO/epoxy composites exhibited the highest thermal conductivity (0.391 W/m-K), which was 1.96 times higher than the neat epoxy. Whereas, the alumina/epoxy composites showed lower increment at the same loading (0.206 W/m-K). However, at 2 wt% RGO, electrical percolation networks had been formed across the matrix (DC conductivity = 2×10-7 S/cm). While, epoxy filled with alumina remained insulative at any loading (~ 10-12 S/cm at 100 Hz). Besides, the tensile strength of the composites was improved by 75% and 37% when filled with 0.5 wt% RGO and alumina, respectively. These results are very useful for preparing multi-functional polymeric materials, which are critically required for packaging industries.