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The uneven deposition at the edges of an evaporating droplet, termed the coffee-ring effect, has been extensively studied during the past few decades to better understand the underlying cause, namely the flow dynamics, and the subsequent patterns formed after drying. The non-uniform evaporation rate across the colloidal droplet hampers the formation of a uniform and homogeneous film in printed electronics, rechargeable batteries, etc., and often causes device failures. This review aims to highlight the diverse range of techniques used to alleviate the coffee-ring effect, from classic methods such as adding chemical additives, applying external sources, and manipulating geometrical configurations to recently developed advancements, specifically using bubbles, humidity, confined systems, etc., which do not involve modification of surface, particle or liquid properties. Each of these methodologies mitigates the edge deposition via multi-body interactions, for example, particle–liquid, particle-particle, particle–solid interfaces and particle–flow interactions. The mechanisms behind each of these approaches help to find methods to inhibit the non-uniform film formation, and the corresponding applications have been discussed together with a critical comparison in detail. This review could pave the way for developing inks and processes to apply in functional coatings and printed electronic devices with improved efficiency and device yield.