The results of a comprehensive study of the structuralmorphological and thermodynamic characteristics of the electrochemical precipitation of Cu in transition holes with a barrier layer of TiN in Si/SiO2 substrates by scanning electron microscopy (SEM) and differential thermal analysis (DTA) are presented. The temperature range that determines the heat resistance of copper (up to 750°C) and the temperature range (up to 886°C) that determines the thermal stability of the composite as a whole, as well as the ability to maintain the chemical composition and ordered structure at elevated temperatures, are found.
Interest in the problem of the relationship between schizophrenia and atherosclerosis is explained by the fact that the general increase in the incidence of atherosclerosis extends to mental patients.
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