No abstract

No abstract

No abstract

No abstract

We report on a new process to make films of Y1Ba2Cu3O7 using coevaporation of Y, Cu, and BaF2 on SrTiO3 substrates. The films have high transition temperatures (up to 91 K for a full resistive transition), high critical current densities (106 A/cm2 at 81 K), and a reduced sensitivity to fabrication and environmental conditions. Because of the lower reactivity of the films, we have been able to pattern them in both the pre-annealed and post-annealed states using conventional positive photoresist technology.