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Photopatternable hybrid inorganic-organic polymers with negative resist behaviour have been developed and tested for evaluation in optical and electrical interconnection technology. They are composed of inorganic oxidic structures cross-linked or substituted by organic groups. The synthesis starts from organosilane precursors reacted by sol-gel-processing in combination with organic crosslinking of polymerisable organic functions. As a result of these functionalities the properties of the ORMOCER®s are adjusted to the particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. The main features of these materials are:• Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels.• Postbaking at moderate temperatures (120 - 170 °C) enables processing on low-cost substrates such as FR-4 (a glass-fibre reinforced epoxy-polymer).• Easily adaptable to thin film technology: spin-on with planarisation > 90 %, via diameters down to 20 μm and high aspect ratio for optical waveguides have been achieved.Synthesis, modification of the resins towards technological needs, their thin film technology and the resulting demonstrators will be discussed.

This paper presents a novel ole-MCM-LID-concept for fully integrated opto-electronic MCM-packaging aiming at: very low cost, very high interconnect density and high performance. The polymer thin film materials technology allowing the integration of optical waveguides and high density electrical interconnects in just 3 thin film layers is also discussed in terms of chemistry, processes and properties. Very good processability and planarization of the new inorganic-organic photo-polymers, ORMOCERs, (ORganically Modified CERamics) in combination with a much lower post-curing temperature (120 "C -170 "C) than alternative materials (such as polyimide and benzocyclobutene) enables the use of low cost polymer substrates such as FR-4 epoxy.Novel surface mountable waveguide-connectors for passive precision alignment, compatible with standard MTopto-connectors can be used for coupling light in and out from the ole-MCM-LID'S. In the demonstrator, laser-arrays (VCSEL's) and photodiode-arrays are flip-chip mounted above UV-excimer laser ablated 45-degree mirrors in the waveguides. Driver-chips and passive components are wirebonded and surface mounted respectively.The modules are also supplied with microvias in the FR4epoxy-substrate connecting to a ball grid array (BGA) underneath. The need of any extra package for connection to next packaging level is thus eliminated. In conclusion the versatility and the low-cost potential of the presented technologies are emphasized.

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