α(6H)-SiC pressure sensors for high temperature applications

Okojie, Robert S.; Ned, A.A.; Kurtz, A. D.; Carr, W.N.

doi:10.1109/memsys.1996.493844

Cited by 30 publications

(11 citation statements)

References 2 publications

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“…Potential high-temperature materials have been investigated as an alternative to silicon. Silicon carbide, polycrystalline diamond and ceramic materials have been reported as high-temperature materials for sensor fabrication [5], [6]. Silicon carbide pressure sensors employ the flexible membrane design and use piezoresistors to measure pressure changes.…”

Section: Introductionmentioning

confidence: 99%

Wireless micromachined ceramic pressure sensor for high-temperature applications

Fonseca

English

Arx

et al. 2002

J. Microelectromech. Syst.

281

162

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In high-temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides high-temperature ceramic materials, fabrication tools, and well-developed processing techniques that have the potential for applicability in high-temperature sensing. Based on this infrastructure, a completely passive ceramic pressure sensor that uses a wireless telemetry scheme has been developed. The passive nature of the telemetry removes the need for electronics, power supplies, or contacts to withstand the high-temperature environment. The sensor contains a passive LC resonator comprised of a movable diaphragm capacitor and a fixed inductor, thereby causing the sensor resonant frequency to be pressure-dependent. Data is retrieved with an external loop antenna. The sensor has been fabricated and characterized and was compared with an electromechanical model. It was operated up to 400 C in a pressure range from 0 to 7 Bar. The average sensitivity and accuracy of three typical sensors are: 141 kHz Bar 1 and 24 mbar, respectively.

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Section: Introductionmentioning

confidence: 99%

Wireless micromachined ceramic pressure sensor for high-temperature applications

Fonseca

English

Arx

et al. 2002

J. Microelectromech. Syst.

281

162

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“…The degradation of silicon's material properties at high temperature render it unsuitable for high temperature applications. Many high temperature materials such as polycrystalline diamond and silicon carbide have been studied as alternative materials to silicon [1]- [4]. Microfabrication techniques with these two materials are still immature although silicon carbide is making great progress [5].…”

Section: Introductionmentioning

confidence: 99%

A ceramic capacitive pressure microsensor with screen-printed diaphragm

Sippola

Ahm

2005

IEEE Sensors, 2005.

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In this work, a ceramic capacitive sealed gauge pressure sensor has been designed, fabricated, and fully characterized for harsh environment pressure microsensor applications. Thick film screen printing has been expanded as a method for creating ceramic microstructures. The ceramic pressure microsensor consists of a bottom electrode deposited on a 96 % alumina substrate and a top electrode deposited on a ceramic diaphragm. The ceramic cavity and diaphragm were created using a thick film sacrificial layer. Hermeticity of the pressure sensor was characterized to assess the sensor's feasibility for MEMS applications such as harsh environment sealed gauge pressure sensors. The sensor showed excellent hermeticity with a maximum leak rate of 7.0 x 10 -10 atm cc/sec He after exposures to temperatures up to 500 o C. The sensor was also fully characterized up to 300 o C in a pressure range of 0 to 50 psi. The average sensitivity over these temperature and pressure ranges was 9.2 fF/psi.

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“…Several approaches to high temperature pressure sensing, such as approaches based on silicon carbide and optical sensors, have been discussed [1]. An alternative approach is based on movable diaphragm ceramic pressure sensors which are read out using passive wireless approaches.…”

Section: Introductionmentioning

confidence: 99%

High Temperature Characterization of Ceramic Pressure Sensors

Fonseca¹,

English²,

Arx³

et al. 2001

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SUMMARYThis work reports functional wireless ceramic micromachined pressure sensors operating at 450 °C, with demonstrated materials and readout capability indicating potential extension to temperatures in excess of 600 °C. These devices are self-packaged and are operating in actual high-temperature environments, not in simulated hot-plate testbeds. A resonant readout technique is employed, in which a planar spiral inductor and a pressure-sensitive capacitor form a passive LC circuit, the resonance frequency of which is sensitive to the external applied pressure, and which can be read out using a simple external loop antenna.

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α(6H)-SiC pressure sensors for high temperature applications

Cited by 30 publications

References 2 publications

Wireless micromachined ceramic pressure sensor for high-temperature applications

Wireless micromachined ceramic pressure sensor for high-temperature applications

A ceramic capacitive pressure microsensor with screen-printed diaphragm

High Temperature Characterization of Ceramic Pressure Sensors

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