Zn thin film on Al metal as thermal substrates for LED application: thermal and optical performance

Shanmugan, S.; Devarajan, Mutharasu

doi:10.1007/s11082-020-02585-1

Cited by 1 publication

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References 27 publications

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“…It has been reported by few researchers on the implementations of thin film as TIM which showed a remarkable performance in their results. Our team has already tested Zn thin film as TIM and observed a noticeable reduction in T J values of the LED tested (Shanmugan and Devarajan, 2020). Published research by Ong et al (2015) showed a lower value in thermal resistance and junction temperature of the tested LED package where B-AlN thin film was prepared by sputtering and used as TIM.…”

Section: Introductionmentioning

confidence: 99%

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

Shanmugan

Devarajan²

2023

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Purpose Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization. Design/methodology/approach Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED. Findings Low value in total thermal resistance (Rth-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(Rth-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The TJ value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔTJ) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition. Originality/value Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the TJ values.

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Section: Introductionmentioning

confidence: 99%

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

Shanmugan

Devarajan²

2023

View full text Add to dashboard Cite

show abstract

Zn thin film on Al metal as thermal substrates for LED application: thermal and optical performance

Cited by 1 publication

References 27 publications

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED

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