“…Electroplated zinc targets resistant to irradiation currents up to 50 μA are present in the literature (e.g., (Neirinckx, 1976). However, specific activities and enriched isotope recovery efficiencies are unreported by these studies, or commonly, copper plating substrates necessitate additional separation prior to replating (Kakavand et al ., 2010; Naik et al ., 2002; Rowshanfarzad et al ., 2004; Sattari et al ., 2006). After irradiation of zinc targets, electrodeposition from their radioactive, dissolved solutions has also been used to speed separation, post-irradiation but again, the reactivity and elemental composition of the final product in solution are unreported (Neirinckx, 1976).…”