2010
DOI: 10.1364/ol.35.003610
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Zernike apodized photon sieves for high-resolution phase-contrast x-ray microscopy

Abstract: We present a type of diffractive lens, Zernike apodized photon sieves (ZAPS), used as the objective for high spatial resolution and high phase-contrast imaging of weakly absorbing materials in x rays. The structure of ZAPS is based on the combination of two concepts: apodized photon sieves and Zernike phase contrast. The ZAPS is a single optic that integrates the appropriate ±π/2 rad phase shift through selective zone placement shifts in an apodized photon sieve. Analysis of the focusing properties of the apod… Show more

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Cited by 32 publications
(17 citation statements)
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“…The apodization parameter may be adjusted to achieve the optimum desired intensity distribution at the focal plane (Cheng et al, 2010(Cheng et al, , 2011. We calculated the PSF intensity distribution of photon sieves with different apodization parameters at focal plane compared with a zone plates.…”
Section: Design Of Photon Sievementioning
confidence: 99%
“…The apodization parameter may be adjusted to achieve the optimum desired intensity distribution at the focal plane (Cheng et al, 2010(Cheng et al, , 2011. We calculated the PSF intensity distribution of photon sieves with different apodization parameters at focal plane compared with a zone plates.…”
Section: Design Of Photon Sievementioning
confidence: 99%
“…In fact, due to its small size, light weight and flexible design, the photon sieve has seen great development since it was invented [13][14][15][16]. So far, a large number of diffractive optical elements based on this type of multi-micropore structure have emerged, such as flat helical nanosieves [17] and ultrahighcapacity non-periodic photon sieves [18].…”
Section: Introductionmentioning
confidence: 99%
“…X-ray imaging is a powerful technique to inspect the features and details of objects which are unable to be viewed using the visible spectrum of light [8][9][10][11][12][13]. Thus, X-ray imaging is a useful tool for the inspection of ICs by examining the details concealed by the packaging surface.…”
Section: Introductionmentioning
confidence: 99%