Young's modulus, hardness and scratch adhesion of Ni–P–W multilayered alloy coatings produced by pulse plating

Papachristos, V.D.; Panagopoulos, C.N.; Christoffersen, Lasse; Markaki, Athina E.

doi:10.1016/s0040-6090(01)01223-8

Cited by 29 publications

(16 citation statements)

References 34 publications

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“…Remarkably, even if an ISE of 10–30% is taken into account, the hardness values obtained in the Cu 1– x Ni x thin films investigated here are clearly much larger than those of microcrystalline or nanocrystalline Cu thin films,4 in concordance with the larger hardness of pure Ni with respect to Cu 39. The hardness of Cu 1– x Ni x films is also considerably larger than in electrodeposited micrometer‐sized pure Ni,25 coarse‐grained Co–Ni alloys,40 as‐deposited ultra‐nanocrystalline Ni–P, Ni–W–P, or Ni–W–Cu–P films41 or Ni‐P‐W multilayered structures 42. Hardness values similar to the ones of the present study have been achieved, for example, in electroplated nanocrystalline Ni–W alloys,43 nano‐multilayered Ni–Cu films,44 or nanocrystalline Ni–Co films 45.…”

Section: Resultsmentioning

confidence: 99%

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

Pellicer

Varea

Pané

et al. 2010

Adv Funct Materials

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Nanocrystalline 3 µm thick Cu1–xNix (0.45 ≤ x ≤ 0.87) films are electrodeposited galvanostatically onto Cu/Ti/Si (100) substrates, from a citrate‐ and sulphate‐based bath containing sodium lauryl sulphate and saccharine as additives. The films exhibit large values of reduced Young's modulus (173 < Er < 192 GPa) and hardness (6.4 < H < 8.2 GPa), both of which can be tailored by varying the alloy composition. The outstanding mechanical properties of these metallic films can be ascribed to their nanocrystalline nature—as evidenced by X‐ray diffraction, transmission electron microscopy, and atomic force microscopy—along with the occurrence of stacking faults and the concomitant formation of intragranular nanotwins during film growth. Due to their nanocrystalline character, these films also show very low surface roughness (root mean square deviation of around 2 nm). Furthermore, tunable magnetic properties, including a transition from paramagnetic to ferromagnetic behavior, are observed when the Ni percentage is increased. This combination of properties, together with the simplicity of the fabrication method, makes this system attractive for widespread technological applications, including hard metallic coatings or magnetic micro/nano‐electromechanical devices.

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Section: Resultsmentioning

confidence: 99%

Nanocrystalline Electroplated Cu–Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior

Pellicer

Varea

Pané

et al. 2010

Adv Funct Materials

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“…The flexural rigidity of a material ( D m ) is given by5, 12 where I m is the moment of inertia of the material with respect to NA of its cross section, A is the surface area of its cross section, y is the distance from NA, and E m is Young's modulus of the material. For a rectangular cross section of thickness h s and width b , the moment of inertia for the substrate ( I s ) is given by The bending modulus of the substrate ( D s ) is where E s is Young's modulus of the substrate.…”

Section: Resultsmentioning

confidence: 99%

Interfacial toughness in polymer‐layered laminar composites

Devasahayam

2004

J Polym Sci B Polym Phys

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The investigation of the interfacial toughness of polymer layered laminar composites with two different approaches produced results differing by up to an order of magnitude and following opposite trends with respect to the strain rates. The flexural modulus and neutral axis of a constrained epoxy‐adhesive layer bound to a painted metal substrate varied with the thickness of the adhesive layer. The adhesion energy depended on the rate at which the force was transmitted to the adhesion bonds—not just on the strength of the adhesion bonds—and on the concomitant strain hardening at high strain rates. As the strain rate and thickness of the polymer layer increased, the transition from a cohesive mode to an adhesive–cohesive (polymer–polymer interface) mode of debonding led to the observed high adhesion energy. The high adhesion energy and increased strain hardening were attributed to the formation of organic–inorganic composites and nanocomposites within the polymer matrix, which evolved as a result of the interactions between the metal oxide pigments and fillers with the polymer matrix during curing. Scission of the polymer chains at the interface was proposed to be the predominant fracture mechanism; it was based on the high relaxation time (∼1017 s) and the high activation energy (∼175 kJ mol−1). © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 3822–3835, 2004

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“…However, Bull [17] showed that substrate hardness and not coating hardness had more influence on the coating-substrate adhesion. Rodrigo and Ichimura [18] and Papachristos et al [19] also found that the adhesion was substantially improved by increasing the substrate hardness.…”

Section: Introductionmentioning

confidence: 92%