YAG laser cutting soda-lime glass with controlled fracture and volumetric heat absorption

Yang, Lijun; Wang, Y.; Tian, Zhixiang; Cai, Na

doi:10.1016/j.ijmachtools.2010.07.001

Cited by 49 publications

(15 citation statements)

References 13 publications

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“…An optical glass microgroove array is an important component in photoelectric systems due to its function of reducing light reflectivity, improving transmittance/diffraction efficiency, and controlling light spectrum distribution [1][2][3]. However, it is difficult to fabricate optical glass microgrooves directly because of the brittleness of the glass materials at room temperature [4][5][6]. Precision glass molding (PGM) is a promising method to fabricate glass microgroove arrays with high efficiency, high accuracy, and low cost [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Defect Analysis in Microgroove Machining of Nickel-Phosphide Plating by Small Cross-Angle Microgrooving

Dong

Zhou

Pang

et al. 2018

Journal of Nanomaterials

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Crystalline nickel-phosphide (c-Ni-P) plating is a newly developed mold material for precision glass molding (PGM) to fabricate microgrooves. In the ultraprecision cutting process of the c-Ni-P plating material, the neighboring microgrooves are required to adjoin with each other to ensure acute microgroove ridges and miniaturize the microgroove size. Generally, defects of burrs and fracture pits can easily occur on the ridges when the plating layer is grooved. Burrs appear when tears dominate in material removal with a large adjacent amount. With the change of the adjacent amount, the removed material is sheared out from the workpiece, and when the cutting depth of the groove ridge is over the brittle-ductile transition thickness, fracture pits arise. To restrict these defects, a small cross-angle microgrooving method is proposed to test the critical adjacent amount range efficiently. It is found that an acute ridge of the microgroove is formed with a small enough adjacent amount; when this amount is in the range of 570 nm~720 nm in the microgroove machining process, fracture pits begin to arise on the gradient edge. High-quality microgrooves can be obtained based on this methodology.

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Section: Introductionmentioning

confidence: 99%

Defect Analysis in Microgroove Machining of Nickel-Phosphide Plating by Small Cross-Angle Microgrooving

Dong

Zhou

Pang

et al. 2018

Journal of Nanomaterials

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“…They studied the effect of laser peak power and pulse duration on drilling. Yang et al [4] studied YAG laser cutting for multiple glass layers and showed that if the upper glass layer temperature is greater than that of the lower layer, the upper layer cutting quality is poor. Samant et al [5] used the Taguchi method to determine the optimal Nd:YAG laser parameters, including pulse width, pulse frequency, and the scanning speed for treating the alumina ceramic surface.…”

Section: Introductionmentioning

confidence: 99%

A theoretical analysis and experimental verification of a laser drilling process for a ceramic substrate

Chen

Hsiao

Wang

et al. 2015

Int J Adv Manuf Technol

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This paper reports theoretical and experimental methods for drilling alumina ceramic substrates by using a nanosecond-pulsed ultraviolet laser. A physical model was established using ANSYS parameter design language finite element software. The influence of laser parameters, such as laser fluence, number of pulses and its duration, and frequency, on morphology-depth, diameter, taper, and temperature distribution-was investigated using three-dimensional confocal laser scanning microscopy. Simulation and experimental results reveal that higher laser fluence and number of pulses produces larger drilling depths and diameters. Laser fluence, pulse duration, frequency, and pulse number of 5.10 J/cm 2 , 1000 μs, 20 kHz, and >9, respectively, can successfully drill through the alumina ceramic substrate. Pulse duration between 3 and 8 ms yielded the smallest hole taper.

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“…As glasses absorb laser energy in a way which is dependent highly on the incident wavelength, 28,29 photon absorption mechanism plays a key role in laser machining of glass materials. When the wavelength of a laser beam is above 5 lm, laser energy is highly absorbed by glasses, such as borosilicate, fused silica, and soda lime.…”

Section: Introductionmentioning

confidence: 99%

“…When the wavelength of a laser beam is above 5 lm, laser energy is highly absorbed by glasses, such as borosilicate, fused silica, and soda lime. 29 CO 2 laser radiation at wavelength of 10.6 lm is strongly absorbed by a Si-O vibration mode. [30][31][32][33] However, CO 2 laser is rarely used to directly ablate glass materials to fabricate microchannels due to the cracks induced by thermal stress.…”

Section: Introductionmentioning

confidence: 99%

Investigation on CO2 laser irradiation inducing glass strip peeling for microchannel formation

Wang

2012

Biomicrofluidics

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The study investigates the use of CO 2 laser to induce glass strip peeling off to form microchannels on soda lime gass substrate. The strip peeling exhibits a strong dependence on the energy deposition rate on the glass surface. In spite of the vast difference in the combination of laser power and scanning speed, when the ratio of the two makes the energy deposition rate in the range 3.0-6.0 J/(cm 2 s), the temperature rising inside glass will be above the strain point and reach the softening region of the glass. As a result, glass strip peeling is able to occur and form microchannels with dimensions of 20-40 lm in depth and 200-280 lm in width on the glass surface. Beyond this range, higher energy depsotion rate would lead to surface melting associated with solidification cracks and lower energy deposition rate causes the generation of fragment cracks.

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YAG laser cutting soda-lime glass with controlled fracture and volumetric heat absorption

Cited by 49 publications

References 13 publications

Defect Analysis in Microgroove Machining of Nickel-Phosphide Plating by Small Cross-Angle Microgrooving

Defect Analysis in Microgroove Machining of Nickel-Phosphide Plating by Small Cross-Angle Microgrooving

A theoretical analysis and experimental verification of a laser drilling process for a ceramic substrate

Investigation on CO2 laser irradiation inducing glass strip peeling for microchannel formation

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