YAG laser assisted etching for releasing silicon micro structure

Minami, Kazuyuki; Wakabayashi, Yoshihiro; Matsubara, Taichi; Yoshimi, K.; Yoshida, Midori; Esashi, Masayoshi

doi:10.1109/memsys.1993.296951

Cited by 8 publications

(6 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Many works have proposed modeling techniques to predict capillary force self-assembly and stiction in MEMS. For instance, calculations and simulations of stiction failure of cantilevers are the subject of an abundant literature [17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35]. Static [5,6] and dynamic [7] models have been computed to explain and ameliorate the massive parallel fluidic self-assembly of microparts.…”

Section: Resultsmentioning

confidence: 99%

“…Stiction is often considered as one of the most critical reliability issue and fabrication failure in MEMS technology [27]. In order to prevent microstructures collapse during sacrificial etching and the contact of moving parts, judicious antistiction treatments such as solvent rinses at elevated temperature [26,27,29] and chemical coatings [30][31][32], or antistiction microstructures such as tabs [33] or temporary support structures [34,35] had been employed. On the opposite, stiction can be controllably used to position and lock on a substrate 3D self-assembled microsystems.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Application of capillary forces and stiction for lateral displacement, alignment, suspension and locking of self-assembled microcantilevers

Rose

Hattori

Kobayashi

et al. 2006

J. Micromech. Microeng.

View full text Add to dashboard Cite

We report the surface-tension-powered self-assembly (displacement, alignment, pulling down and locking) of microcantilevers. Capillary forces-assisted displacement is realized by compression of four arrays of springs linked to the opposite lateral sides of the cantilevers. After in-plane translation along the initial cantilever orientation, the microstructure is pulled down and locked on the substrate by stiction. Spring and capillary forces are described with a simple analytical model. Complete self-assembly occurs when the layout of the whole system (the cantilever with its traveling spring structure, the surrounding area and the local distribution of the liquid) is well designed. We show that the presence of a water meniscus trapped at a step edge in the vicinity of the tip end of a microcantilever could lead to stiction failure before traveling of the structure. Small beams (6 µm long) protruding over step edges were fabricated by adding a mechanically assisted displacement step (with a microneedle) to the self-assembly experiment.

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Application of capillary forces and stiction for lateral displacement, alignment, suspension and locking of self-assembled microcantilevers

Rose

Hattori

Kobayashi

et al. 2006

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…Minami et al (1993)] Laser assisted silicon etcing has been developed and applied for three-axis accelerometer and resonators described above.…”

Section: Laser Assisted Etchingmentioning

confidence: 99%

Encapsulated micro mechanical sensors

Esashi

1994

Microsystem Technologies

View full text Add to dashboard Cite

Encapsulated micro mechanical sensors were fabricated using glass-silicon anodic bonding and an electrical feedthrough structure. Two parallel plates which can be used not only for capacitive sensors but also electrostatic actuators are adopted for integrated sensors as capacitive pressure sensors, accelerometers and resonating sensors. Micromachining technologies were developed for these packaged micro sensors. These include silicon etching technologies as laser assisted etching, deep RIE and in-process thickness monitoring during wet etching. Anodic bonding technologies which enable to incorporate a circuit inside the package and to keep a sealed cavity at a high vacuum are also developed.

show abstract

“…The operation of different types of gas lasers, such as the Argon-ion laser, Excimer laser, and CO 2 laser [8 -12], depends on its emission wavelength and output power. Laser systems with different laser sources, such as the carbon dioxide (CO 2 ) laser [11], Excimer ultraviolet laser [8], Nd:YAG solid-state laser [13][14][15], Yb:YAG disc laser [9], and Yb fiber laser [1], are also suitable for silicon etching.…”

Section: Introductionmentioning

confidence: 99%

“…The interaction between laser ablation and the surface being etched depends largely on the laser beam parameters, as well as the physical and chemical properties of the silicon. Therefore, proper methods of conducting laser source selection and laser parameter optimization are important to minimize sample damage [14,16].…”

Section: Introductionmentioning

confidence: 99%

Laser-Assisted Silicon Etching for Micro Fuel Cell Electrode Plate Fabrication

2019

MJAS

View full text Add to dashboard Cite

Silicon electrode plates for micro fuel cells were obtained using a microfabrication process based on the micro-electromechanical system (MEMS) technology. The dry etching process involved the laser ablation technique using the highly stable Nd:YAG. This technique is suitable for micromachining silicon substrates. The total size of the electrode plate was 2.5 cm x 2.5 cm and the active reaction area was 1 cm 2. An increase in laser scan numbers deepened the groove being etched on the silicon sample, but it showed a saturated behavior as the number of scans became higher. The time required to etch a complete electrode plate flow field with 14 square-shaped through-holes of 0.185 cm x 0.185 cm area using laser ablation was ~30 minutes, which was much shorter than the wet etching time of more than 10 hours with the potassium hydroxide solution (KOH) solution. The laser-etched flow field achieved vertical sidewalls as per the original design, whereas the wet-etched structure achieved a typical anisotropic hole structure with sidewalls that were approximately 54º to the electrode surface due to the <100> orientation of the silicon wafer. Therefore, the laser ablation technique was chosen to produce the electrode plates for the micro fuel cell as it can save time on the etching process and produce more precise flow field dimensions for the electrode plates with less process steps compared with the conventional wet etching processes using KOH solution.

show abstract

YAG laser assisted etching for releasing silicon micro structure

Cited by 8 publications

References 6 publications

Application of capillary forces and stiction for lateral displacement, alignment, suspension and locking of self-assembled microcantilevers

Application of capillary forces and stiction for lateral displacement, alignment, suspension and locking of self-assembled microcantilevers

Encapsulated micro mechanical sensors

Laser-Assisted Silicon Etching for Micro Fuel Cell Electrode Plate Fabrication

Contact Info

Product

Resources

About