XPS investigation of the chemical characteristics of Kapton films ablated by a pulsed TEA CO2 laser

Zeng, Dawen; Yung, Kam Chuen; Xie, Changsheng

doi:10.1016/s0257-8972(01)01696-6

Cited by 78 publications

(54 citation statements)

References 26 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…4(c)] due to the breakage of the imide rings of Kapton film and the formation of the amide groups. 17,19,22,25 As reported earlier, 24,35 for the untreated Kapton film, at least four different carbon environments are found for the C 1s region: (i) carbon atoms bonds from the aromatic rings that are not directly attached to the imide ring at 284.6 eV (C-C), (ii) carbon atoms bonded to nitrogen at 285.6 eV (C-N), (iii) carbon atoms bonded to oxygen related to the ether group (C-O), and (iv) carbon atoms bonded with oxygen in the imide ring at 288.6 eV assigned to the carbonyl group (C‫ס‬O). In addition, there is a shakeup at 290.9 eV arising from the aromatic rings.…”

Section: Resultssupporting

confidence: 60%

“…Another suitable surface sensitive technique is x-ray photoelectron spectroscopy (XPS), which has been widely used for investigating the changes in the composition and chemical states of the ablated surface. 20,[22][23][24][25][26] Several studies have shown that there are novel ablation behaviors near the threshold. For the purely photothermal mechanism involved in UV pulsed laser ablation of polyimide, the ablated depth ⌬h near the threshold shows an Arrhenius-type behavior ⌬h ‫ס‬ Aexp(−B/F); in contrast, for the purely photochemical mechanism (193 nm ArF-laser), the ablated depth ⌬h near the threshold can be accurately predicted by Beer's law ⌬h ‫␣ס‬ −1 ln(F/F th ).…”

Section: Introductionmentioning

confidence: 99%

“…33,34 Also, it was usually used as an model material for studying the ablation mechanism. 19,24 In this paper, near threshold laser ablation of Kapton film was carried out using a UV pulsed laser at 355 nm. To ascertain the ablation mechanism, the composition and chemical states of the ablated surface are systematically investigated by XPS and the decomposition path of the Kapton film is discussed in details.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Near-threshold ultraviolet-laser ablation of Kapton film investigated by x-ray photoelectron spectroscopy

2003

View full text Add to dashboard Cite

Near-threshold ultraviolet-laser (355 nm) ablation of 125-μm thick Kapton films was investigated in detail using x-ray photoelectron spectroscopy. Different from the irradiation at higher fluences, the contents of the oxygen, amide group, and C–O group on the ablated surface increased with an increase in the pulse number, whereas the carbon contents decreased, although the contents of the nitrogen and the carbonyl group (C = O) decreased slightly. This implied that there was no carbon-rich residue on the ablated surface. Near the ablation threshold, only photolysis of the C–N bond in the imide rings and the diaryl ether group (C–O) took place due to a low surface temperature rise, and the amide structure and many unstable free radical groups were created. Sequentially, the oxidation reaction occurred to stabilize the free radical groups. The decomposition and oxidation mechanism could explain the intriguing changes of the chemical composition and characteristics of the ablated surface. In addition, the content of the C–O group depended on the opposite factors: the thermally induced decomposition of the ether groups and the pyrolysis of the Caryl–C bond. Upon further irradiation, the cumulative heating may induce the breakage of the Caryl–C bond and enhance the oxidation reaction, resulting in an increase of the content of the C–O group.

show abstract

Section: Resultssupporting

confidence: 60%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Near-threshold ultraviolet-laser ablation of Kapton film investigated by x-ray photoelectron spectroscopy

2003

View full text Add to dashboard Cite

show abstract

“…7(c). Three peaks at 529.9, 531.1 and 533.6 eV are assigned to O 2− , carbonyl group (C O), and (C-O) or Sn-O, respectively [46][47][48]. In ITO films, the low binding energy O 1s component at 529.9 eV is attributed to oxygen in the form of oxide, O 2− present on ITO surface [49,50].…”

Section: Effect Of Molecular Dipole On Ito Work Functionmentioning

confidence: 99%

Modification of ITO surface using aromatic small molecules with carboxylic acid groups for OLED applications

et al. 2011

View full text Add to dashboard Cite

a b s t r a c t 4-[(3-Methylphenyl)(phenyl)amino]benzoic acid (MPPBA) was synthesized in order to facilitate the hole-injection in Organic Light Emitting Diodes (OLED). MPPBA was applied to form self-assembled monolayer (SAM) on indium tin oxide (ITO) anode to align energy-level at the interface between organic semiconductor material (TPD) and inorganic anode (ITO) in OLED devices. The modified surface was characterized by X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and Kelvin probe force microscopy (KPFM). KPFM was used to measure the surface potential and work function between the tip and the ITO surface modified by SAM technique using MPPBA. The OLED devices (ITO/MPPBA/TPD/Alq 3 /Al) fabricated with SAM-modified ITO substrates showed lower turn-on voltages and enhanced diode current compare to the OLED devices fabricated with bare ITO substrates.Crown

show abstract

“…6) Flexural endurance and long-term reliability of the FCCL acting as an electrically connector fundamentally rely on the peel strength of the FCCL, which is inherently related to the adhesion between the metal (Cu) and PI. 7) Mechanical reliability of the Cu/PI films is problematic because of poor interface adhesion strength. This is because Cu does not form a strong chemical bond with the constituent elements of the PI.…”

Section: Introductionmentioning

confidence: 99%

Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process

et al. 2010

View full text Add to dashboard Cite

The adhesion strength of a Cu/Cr/polyimide (PI) flexible copper clad laminate (FCCL), which was manufactured by the roll-to-roll process, was evaluated according to the thickness of the Cr seed layer using the 90 peel test. The changes in the morphology, chemical bonding and adhesion properties were characterized by scanning electron microscopy, atomic force microscopy and X-ray photoelectron spectroscopy. The peel strength of the FCCL decreased with increasing Cr layer thickness. The higher FCCL peel strength was attributed to the lower proportion of C-N bonds and higher proportion of C-O or carbonyl (C=O) bonds on the PI surface compared to the FCCL with the lower adhesion strength. The FCCL with the higher peel strength had a fractured PI surface with a higher surface roughness. The adhesion strength between the metal and PI was mostly attributed to the chemical interaction between the metal layer and the functional groups of the PI.

show abstract

XPS investigation of the chemical characteristics of Kapton films ablated by a pulsed TEA CO2 laser

Cited by 78 publications

References 26 publications

Near-threshold ultraviolet-laser ablation of Kapton film investigated by x-ray photoelectron spectroscopy

Near-threshold ultraviolet-laser ablation of Kapton film investigated by x-ray photoelectron spectroscopy

Modification of ITO surface using aromatic small molecules with carboxylic acid groups for OLED applications

Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process

Contact Info

Product

Resources

About