2007
DOI: 10.1016/j.nima.2006.10.092
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XPAD3: A new photon counting chip for X-ray CT-scanner

Abstract: International audienceThe X-ray pixel chip with adaptable dynamics (XPAD3) circuit is the next generation of 2D X-ray photon counting imaging chip to be connected to a pixel sensor using the bump and flip-chip technologies. This circuit, designed in IBM 0.25 μm technology, contains 9600 pixels (130 μm×130 μm) distributed into 80 columns of 120 elements each. Its features have been improved to provide high-counting rate over $10^9$ ph/pixel/mm$^2$, high-dynamic range over 60 keV, very low-noise detection level … Show more

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Cited by 68 publications
(43 citation statements)
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“…Starting with high-energy physics applications in the Delphi and ATLAS experiments [1], we have also developed several chips for synchrotron applications [2,3]. The latest, called XPAD3-S, has been extensively described elsewhere [4]. The main features of this chip are summarized in Table 1.…”
Section: The Read-out Chipmentioning
confidence: 99%
“…Starting with high-energy physics applications in the Delphi and ATLAS experiments [1], we have also developed several chips for synchrotron applications [2,3]. The latest, called XPAD3-S, has been extensively described elsewhere [4]. The main features of this chip are summarized in Table 1.…”
Section: The Read-out Chipmentioning
confidence: 99%
“…To this, we have designed a new chip named XPAD3 [3] with pixels of 130 Â 130 mm 2 , precise threshold adjustment, and very fast frame readout (o2 ms). Moreover, the XPAD3 has been equipped with an energy selection circuit to act as a band-pass emission filter.…”
Section: Prospectsmentioning
confidence: 99%
“…It can be bump-bonded with Si, CdTe or GaAs sensors to optimize detection efficiency with regards to the energy spectrum of X-rays. The XPAD3 circuit was manufactured in IBM 0.25 μm technology during summer 2006 [5].…”
Section: Introductionmentioning
confidence: 99%