Untitled

Role of structural parameters of ultra-fine grained Cu for its fatigue and crack growth behaviour

“…The threshold stress intensity factor for HPT Cu is around 3 MPa √ m, which is close to the effective threshold value K th,eff measured for bulk CG Cu [9]. CG Cu shows a zig-zag crack path and slip marks that cover the surface in a range of 100 m on both sides of the crack.…”

“…To investigate the fatigue crack growth behaviour of the small-sized HPT specimens, a set-up previously used for measuring thin foils was adopted [9]. Disc-shaped HPT specimens with a diameter of 10 mm were polished down to a thickness of 200 m and an elliptical through notch (1.5 m × 0.5 m) was introduced in the centre of the specimen.…”

Scattering in Fatigue Crack Growth of Thin Pure Copper Sheet for Smart Stress Memory Patch

“…Furthermore, there were few studies about fatigue crack growth behavior of thin metallic sheet with thickness of a few hundred micrometer such as this patch. Klein and Hadrboletz et al 10,11) studied fatigue crack growth behavior of thin metallic foils with thickness ranging from 20 to 250 mm and reported that the crack arrest was observed due to the stress state of crack tip which is determined by the plastic zone size and the thickness.…”

Experimental investigations of the effect of thickness on fracture toughness of metallic foils

“…Also, the grain size dependence of ductile fracture toughness was discussed in terms of the influence of yield strength and strain to fracture, as well as of the effect of deformation homogeneity across the grain. Further research regarding size effect on fatigue behavior of thin films has shown that the mechanical behavior was closely related to the thickness and grain size of the films [5][6][7][8][9]. Klein et al [10] studied the stress-strain behavior of thin metallic foils of Cu and Al with varying thickness ranging between 10 and up to 250 m and the fatigue crack propagation properties of the above mentioned Cu foils as function of thickness.…”