X-IDDQ: A Novel Defect Detection Technique Using IDDQ Data

Abstract

Abstract

Application of Contactless Testing to PCBs with BGAs and Open Sockets

“…Similarly to T race 1 , Table 3 shows that the deviations of the correct PCBs remain acceptable, while the defective PCBs 12 Open at BGA side 77.63 P CB 13 Open at BGA side 92.24 P CB 14 Open at socket side 101.98 P CB 15 Open at socket side 108.53 P CB 16 Bridge at socket side 113.22 P CB 17 Bridge at socket side 141.97 …”

“…Statistical test approaches have been used in several publications and mainly for chip-level testing. In [1,7,8,15], the authors employed the principal component analysis (PCA) technique for defect identification and test process development while measuring the integrated circuit quiescent current (I DDQ ) for an IC under test. Capacitive plate technique which extends boundary-scan testing for better test coverage [10] has been improved for its effectiveness by using PCA in [5].…”

Principal Component Analysis-based compensation for measurement errors due to mechanical misalignments in PCB testing

“…Singular Value Decomposition (SVD) decomposes the matrix into the form Mc =USV. The Principle Component score or Z-score matrix Z mxn is given by, Z=MV [5]- [11]. Each principle component (PC) is statistically independent, and they are arranged such that an earlier PC is more significant than a later one.…”

Electro-thermal characterization of a differential temperature sensor in a 65 nm CMOS IC: Applications to gain monitoring in RF amplifiers

“…absolute temperature monitoring [1]), structural integrity verification (i.e. built-in-test approaches [2]), variability monitoring [3], and yield enhancement (so called self-healing strategies [4]). If the sensor is used to monitor the performances or the structural integrity of high frequency analog circuits, one of the requirements is that it should be non-intrusive, i.e.…”